Discrete semiconductor devices
We are a new own design base manufacturer for mosfet, triac, scr and transistor in korea who had
Launched biz since 2003.
Our tech for mosfet
1. Stripe d-mos
2. Trench
LAYER - Double side
Application For semiconductor inspection
Thickness - 0.07 T
Drill Min - 0.3 mm
Inspection spec - Zero defect
SPECIAL item for controlling - Hole tolerance [+-0.01]
SPECIAL item for controlling - Space between line [+-0.02]
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PIXEL 8M 13M 16M 20M
Flatness & Tilt Special :30
Thickness 0.25T ~ 0.45T
Structure 2-3L DRILL, 1-2L, 3-4L BLIND VIA
Machine Drill Min. 0.15mm
Laser Drill BVH Min. 0.10mm
Cu Plating 18[+-3] / PTH or Via Fill
BGA PITCH 0.4mm Under
LAYER Rigid Flexible 4LAYER [4-2-4] / [4-2-2]
PSR BLACK , BLUE , GREEN
Surface treatment ENEPIG
Stiffner PI , SUS
Other EMI
Impedance 100
LAYER FPCB S/S
Application Medical equipment
Thickness 0.06T
L/S 50/50
DRILL/LAND 200/400
Inspection spec Zero defect on circuit
SPECIAL item for controlling Stair-shape at inner circuit
We are a trader of Semiconductor Chips
We handle various types of semiconductor chips and supply only 100% authorized products.
If you are interested, please let us know the following information for your needing semiconductor chip.
Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
Features of the product - Si Wafer Damage Relief design - Damage area minimizing design and Wheel design considering Ra - Guttering effect Wheel design
