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Camera Module Rigid Flexible Manufacturing Spec

(1.1)
Supplier From South Korea (Republic Of Korea)
Nov-17-21

PIXEL 8M 13M 16M 20M
Flatness & Tilt Special :30
Thickness 0.25T ~ 0.45T
Structure 2-3L DRILL, 1-2L, 3-4L BLIND VIA
Machine Drill Min. 0.15mm
Laser Drill BVH Min. 0.10mm
Cu Plating 18[+-3] / PTH or Via Fill
BGA PITCH 0.4mm Under
LAYER Rigid Flexible 4LAYER [4-2-4] / [4-2-2]
PSR BLACK , BLUE , GREEN
Surface treatment ENEPIG
Stiffner PI , SUS
Other EMI
Impedance 100

Price and Minimum Quantity

Price: Negotiable
MOQ: Not Specified
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Supplier Of Electronic Semi Conductor Devices & Other Components

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