Hdi Rigid Flexible Manufacturing Spec

Jinsung Electronics company produces High-end Rigid-Flex PCB which is used for multiple product groups such as smartphones, camera module, electric apparatuses, medical devices, defense articles, and so on supplying to domestic and global market

1. LAYER : 6 Layer (FLEXIBLE 2 layer+RIGID 4 layer) 6-2-6
2. Application : Inspection equipment of Semiconductor
3. Thickness : 0.5T
4. Structure : 1-2LBVH ,2-3L BVH 1-4 STACK BVH , 4-6BVH , 56BVH
5. Machine Drill : Min. 0.25mm
6. Cu Plating : VIA FILL + PTH
7. BGA(LAND/PTICH) : 0.3 mm / 0.4pitch

LAYER 10LAYER [FLEXIBLE 4L + RIGID 6L] 10-4-10
Application GPS
Thickness 1.6T
Machine Drill Min. 0.2mm
Laser Drill BVH Min. 0.1mm
Cu Plating HOLE Min. 25
L/S 100/100
PSR GREEN
Surface treatment ENEPIG, ENIG
Impedance LAYER 1L, 4L, 8L, 10L
Impedance spec 50 / 100

PIXEL 8M 13M 16M 20M
Flatness & Tilt Special :30
Thickness 0.25T ~ 0.45T
Structure 2-3L DRILL, 1-2L, 3-4L BLIND VIA
Machine Drill Min. 0.15mm
Laser Drill BVH Min. 0.10mm
Cu Plating 18[+-3] / PTH or Via Fill
BGA PITCH 0.4mm Under
LAYER Rigid Flexible 4LAYER [4-2-4] / [4-2-2]
PSR BLACK , BLUE , GREEN
Surface treatment ENEPIG
Stiffner PI , SUS
Other EMI
Impedance 100

Ezpcb capability:
Layers:1-40
Materials:fr-4, fr-1, cem-1, cem-3, teflon, rogers, al base
Max. Board size:550mm x 710mm
Board thickness:0.15mm-5mm
Finished copper thickness:1/2oz-10oz
The min. Track:3mil (0.075mm)
The min. Clearance:3mil (0.075mm)
The min. Hole diameter:0.10mm
Finish:hasl, gold plated, immersion gold/silver

Vacuum packing, box

Place of origin: taiwan
Base material: varied
Copper thickness: 0.45 mils - 14 mils

Annular ring: 1.5 mils
Inner line width: <0.05 mm (2 mils)
Min. Finished trace space: 3 mils
Min. Inner trace space: 1.5 mils
Smt pitch: 0.3 mm
Copper to board edge: 5 mils

1 piece per vacuum plastic bag

Brand Name: strongtimes
Number of Layers: 4
Base Material: FR-4
Copper Thickness: 3mil
Board Thickness: 1.6mm
Min. Hole Size: 4mil
Min. Line Width: 3mil
Min. Line Spacing: 3mil
Surface Finishing: lead free hal
Printed Circuit board, Single Side PCB, Double Side PCB, Multilayer PCB, Rigid Flexible PCB, Rigid PCB,
Flexible PCB, Impedance PCB, HDI PCB, MCPCB, FPC, Aluminum PCB, PCB, PCBA

StrongTimes Electronics Co., Ltd is a high and new technological company which specializing in manufacturing single-sided,
double-sided and multilayer PCB of high precision, high density and high reliability.

Brand Name: strongtimes
Number of Layers: 4
Base Material: FR-4
Copper Thickness: 3mil
Board Thickness: 1.6mm
Min. Hole Size: 4mil
Min. Line Width: 3mil
Min. Line Spacing: 3mil
Surface Finishing: lead free hal
Printed Circuit board, Single Side PCB, Double Side PCB, Multilayer PCB, Rigid Flexible PCB, Rigid PCB,
Flexible PCB, Impedance PCB, HDI PCB, MCPCB, FPC, Aluminum PCB, PCB, PCBA

StrongTimes Electronics Co., Ltd is a high and new technological company which specializing in manufacturing single-sided,
double-sided and multilayer PCB of high precision, high density and high reliability.

IPC Releases 5 New Standards for Flexible/Rigid-Flexible Printed Boards and Performance of Rigid Printed Boards

IPC announces the release of five newly revised standards covering several areas of the supply chain.

IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness PCB Assemblies

IPC-2223E, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-2591-Version 1.1, Connected Factory Exchange (CFX)

IPC-1791A, Trusted Electronic Designer, Fabricator and Assembler Requirements

IPC- 6012E, Qualification and Performance Specification for Rigid Printed Boards

PURCHASE NOW



Details on some of the changes for the newly released standards:



IPC/WHMA-A-620D provides several changes that were requested by the industry. The task group addressed the target conditions in the document by moving some conditions to acceptable criteria while other cases were moved to training.



There are several new or revised graphics

The solderless wrap section was completely revised

A new section was added for over-molding of flexible flat ribbon

IPC-2223E establishes the specific requirements for the design of flexible and rigid-flexible printed board applications and its forms of component mounting and interconnecting structures.



Several figures are updated

New sections and comments on microvia stacking

Back-drilled holes and dual row zero insertion force (ZIF) connectors updated

IPC-6012E establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards.



Provides new acceptance criteria for back drilled holes

Establishes new requirements for copper wrap plating of holes in new designs

Discusses reliability issues for microvia structures in class 3 products

IPC-2591 V1.1 establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing.



provides changes made to message sections, and message structure sections

Appendix A was added with a short description of all changes from V1.0

Appendix B provides acronyms and abbreviations

IPC-1791A provides minimum requirements, policies and procedures for printed board design, fabrication and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products.



New Appendix D covering requirements for trust certification of non-U.S. electronic design, fabrication and assembly organizations

Several sections have been updated from Scope through and including 3.0requirements

Classifications of Class I, 2 and 3 have been added

Layers: 1-4l
Copper weight: 0.5-2 oz
Board thickness range: 0.06-0.3mm
Overlay thickness range: 1/0.5mil
Tracks and space standard: >= 0.1mm (4mil)
Surface finishes: osp, enig and gold-plated