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Find Verified Grinding Wheel Suppliers, Manufacturers and Wholesalers

Top Supplier Cities : Seoul   Gimpo   -  
Jun-13-18
Supplier From Inchun-si, South Korea (Republic Of Korea)
 
Sapphire Wafer Back Grinding Wheel - Sapphire Boule Processing Cup wheel -Core Drill for Ingot -Flat surface Grinder Wheel -Sapphire Wafer Grinder Wheel

Usage of the products :
Sapphire Wafer - Wafer Thinning Processing Back Grinder Wheel.

Grinder Wheel for LED Process:

Grinder Load Reducing Design:
-Wafer Damage(Down) with Efficient Wheel Blade wafer Touch Surface
- Efficient Grinder heat radiation with Wheel blade cw direction diagonal model design.

Sapphire Wafer friendly Wheel design-Wheel design with priority in product Quality.

Wheel Life Time Easy adjusting design with priority in quality.
Jun-13-18
Supplier From Inchun-si, South Korea (Republic Of Korea)
 
Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
Jun-13-18
Supplier From Inchun-si, South Korea (Republic Of Korea)
 
SI wafer Dicing Saw Blade Produce Vitrified,Metal,Resin,Blade that efficiently cut various Materials- silicon Wafer,Sapphire,alumina,LCD or electronic Parts with Precision and excellent efficiency

Usage of the products :
Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process.
Jun-13-18
Supplier From Inchun-si, South Korea (Republic Of Korea)
 
Sapphire Ingot C Surface Cutting Saw or Grinder Cup Wheel - Sapphire Boule Processing Cup wheel -Core Drill for Ingot -Flat surface Grinder Wheel -Sapphire Wafer Grinder Wheel

Usage of the products :

Sapphire Ingot: Sapphire Boule C Standard Surface Processing Cup Wheel - Ingot Core Processing Core Drill - Ingot C Surface Flattening Cup Wheel - Ingot Cylinder Grinder Cup Wheel

Grinder Wheel for LED Process:
Grinder Load Reducing Design: -Wafer Damage(Down) with Efficient Wheel Blade wafer Touch Surface - Efficient Grinder heat radiation with Wheel blade cw direction diagonal model design.

Sapphire Wafer friendly Wheel design-Wheel design with priority in product Quality.

Wheel Life Time Easy adjusting design with priority in quality.
Jun-13-18
Supplier From Inchun-si, South Korea (Republic Of Korea)
 
Resin Bonded Wheels is manufactured by mixing synthetic resin (phenol and Polyimide) and fillers super abrasive materials.

Usage of the product:
Resin Bonded Wheels can be effectively used in the brodest range of appliances.
Resin Bonded Wheels can be designed for both wet and dry grinding modes.
357 Grinding Wheel Suppliers
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Jun-13-18
Supplier From Inchun-si, South Korea (Republic Of Korea)
 
Vitrified Bonded Wheels is very fragile as a mixture of glass materials is used.
It is more excellent in bonding.
Strength than the Resin bond.
It can adjust its strength and chip discharging function by changing its porosity and Structures.
Jun-13-18
Supplier From Inchun-si, South Korea (Republic Of Korea)
 
Usage of the products :

Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
Jun-13-18
Supplier From Inchun-si, South Korea (Republic Of Korea)
 
Usage of the products :

Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
Jun-13-18
Supplier From Inchun-si, South Korea (Republic Of Korea)
 
Usage of the products :

Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
Apr-18-23
Supplier From Seoul, Geumcheon-gu, South Korea (Republic Of Korea)
Jan-13-16
Supplier From Kimhae, South Korea (Republic Of Korea)
GOLD Member
Feb-25-25
Supplier From Busan, South Korea (Republic Of Korea)
 
CASE MW36 Wheel Loader - Typical Specifications
Operating Weight: Approximately 3,200 to 3,600 kg (about 7,000 to 8,000 lbs)
Bucket Capacity: Generally around 0.65 to 0.9 cubic meters
Dimensions:
Overall Length: Approximately 4.0 m (varies with configuration)
Width: Roughly 2.5 m
Height: Around 3.0 m
Lift Height: Typically in the range of 2.5 to 3.0 m
Transmission: Options may include hydrostatic or mechanical drive, depending on the model configuration
Additional Features:
Ergonomic operator station
Versatile hydraulic system for various attachments
Jun-08-18
Supplier From Inchun-si, South Korea (Republic Of Korea)
GOLD Member
Nov-14-19
Supplier From Busan, South Korea (Republic Of Korea)
Jun-15-10

Car Wheel

MOQ: Not Specified
Supplier From Hanam-si, Kyounggi -do, South Korea (Republic Of Korea)
 
1565, 35, 5h/114.3, 8h/100~114.3 67~73.1 cast
1675, 35, 5h/114.3, 8h/100~114.3 67~73.1 cast
1780, 35, 4h 5h/114.3, 67.1~73.1 flow forming
1880/1890, 1985/1995, etc.

Export standard packing
GOLD Member
Feb-25-25
Supplier From Busan, South Korea (Republic Of Korea)
 
Based on the serial number 10KA0976, your equipment is a SkyTrak 10000M ATLAS telehandler, also known as the All-Terrain Lifter Army System (ATLAS) with a 10,000 lb capacity. Here are the key specifications:
Lifting Capacity: 10,000 lbs (4,536 kg)
Maximum Lift Height: Approximately 27.5 ft (8.38 m) with the 10,000 lb carriage
Maximum Reach: Approximately 24 ft (7.4 m)
Dimensions:
Height: 102 inches (259 cm)
Width: 100 inches (254 cm)
Turning Radius: 13.5 ft (4.1 m)
Frame Tilt: 9 degrees each way
Hydraulic Reservoir Capacity: 55.6 gallons (214 liters)
Fuel Tank Capacity: 44 gallons (167 liters)
Boom: Telescopic 3-stage
Steering Modes: 2-wheel, 4-wheel, and crab steering
Fording Depth: Up to 36 inches (91 cm)
Transportability: Air transportable in C-130, C-141, C-5A, and C-17 aircraft
Aug-22-17

Car Wheel

MOQ: Not Specified
Supplier From Seoul, South Korea (Republic Of Korea)
 
Price of product (USD price or FOB price) - Ask for price
Product Origin - South Korea
Minimum Order Size and Packaging details - 1 pieces / general export packing
Jun-13-18
Supplier From Inchun-si, South Korea (Republic Of Korea)
 
Semiconductor :

Usage of the products :

Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process

Features of the product - Si Wafer Damage Relief design - Damage area minimizing design and Wheel design considering Ra - Guttering effect Wheel design
Jun-13-18
Supplier From Inchun-si, South Korea (Republic Of Korea)
 
Dicing Blade :


Usage of the products :

Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process.

Features of the product - Si Wafer Damage minimizing design - Productivity & Life Time optimizing designed.
Jun-13-18
Supplier From Inchun-si, South Korea (Republic Of Korea)
 
Sapphire ( Led Material) :

Usage of the products : Sapphire Ingot - Sapphire Boule C Standard Surface Processing Cup Wheel - Ingot Core Processing Core Drill - Ingot C Surface Flattening Cup Wheel - Ingot Cylinder Grinder Cup Wheel, Sapphire Wafer - Wafer Thinning Processing Back Grinder Wheel.

Features of the product : Product Design with Priority in Quality, Processing and Productivity and Material Life Time Improvement - Machine & Material customized process optimization
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