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Si Wafer Back Grinding Wheel

Supplier From South Korea (Republic Of Korea)
Jun-13-18

Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process

Price and Minimum Quantity

Price: Negotiable
MOQ: Not Specified

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1) grinding wheels for stainless steel, glass, steel, and masonry
2) dimensions: 4" x 3/32" x 5/8"(100 x 2.5 x 16mm)
3) product specification: wa 80/gc 80/ac 80 sbf

Characteristics and applications of discs:
1) applications: general purpose disc for stone working
2) nets in bottom side of the disc
3) characteristics: standard quality, made of normal grade corundum, medium
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Operation description:
1) we must operate the discs correctly, or they will make dangerous to us;
The discs should be mounted with the flanges very tightly; the workers
Should operate the discs with safeguard
2) the discs are for metal or stone applications, and we should use them for
Right applications
3) to use suitable hand tools for operation of different sizes discs, with

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