High Tg Pcb

High-TG PCB High Temperature PCB fr4 Material
The Glass Transition Temperature (Tg) is one of the most important properties of any epoxy and is the temperature region where the polymer transitions from a hard, glassy material to a soft, rubbery material.
Circuit board material must flame-resistant, it canâ??t be burned at a certain temperature and only be soften. The temperature point is called the glass transition temperature (Tg).
The higher Tg point means higher temperature requirement during lamination. And the Aluminum clad Circuit Boards will be hard and crisp, which will affect hole and the electrical properties.
Ordinary PCB materials at high temperatures, not only will be soften, deformation, melting and other phenomena, but also the mechanical and electrical properties decline sharply.
General fr4 Tg is 130-140 centigrade, moderate Tg is greater than 150-160 centigrade, High-Tg is greater than 170 degrees.
The higher of Tg, the better performance of PCB heat resistance, moisture resistance, chemical resistance, stability and other characteristics.
FR4 is a code name for grade of Epoxy Glass material.
Tg means Glass Transition Temperature.
When the working temperature reaches to the melting point, that means the temperature exceeds the Tg value, the status of pcb material will be changed from glassy to liquid, which will affect the function of pcb. And this value is related to the stability of the pcb dimension.
As usual, made with Tg â?¥ 170â?? pcb material, which is called high Tg printed circuit board. With the rapid development of the electronics industry, high Tg material is widely used in computer, communication equipment, precise apparatus and instrument and etc.

Double side high TG PCB assembly 0201 components
PCBA Supplier, pcba processing manufacturer
4 YAMAHA High-speed SMT Lines
6 million daily SMT placements capability
400,000 daily DIP placements capability
500Ã?600 mm Maximum Board Size
0.25"x 0.25" Minimum Board Size
450 mm Max. Width for Wave-Solder
Passives Components Down to 0201 Size BGA and VFBGA Leadless Chip Carrier/CSP Double-Sided SMT Assembly Fine Pitch to 08 Mil BGA Repair and ReballPart Removal and Replacement
SMT and DIP/X-RAY Inspection/AOI Testing/In-circuit-test (ICT)/Flying Probe/Function Test/Burn-in/Finished products assembly

Number of Layers:
1-64-Layer
Base Material:
FR4,High-TG ,Rogers,Nelco,RCC,PTFE
Copper Thickness:
0.3-12oz
Board Thickness:
0.6-10mm
Min. Hole Size:
0.03mm
Min. Line Width:
0.035
Min. Line Spacing:
0.035
Surface Finishing:
HASL, Immersion Gold/Tin/Silver ,OSP
Board Size:
5mm*5mm-610mm*1100mm

Board thickness: 0.2mm-6.0mm
Laminate: fr-4, taconic, rogers, tg170, tg180, cem-1
Layers: single side, double side, multilayer
Outer / inner coppers: 1/1 oz, 1/2 oz, 2/2 oz, 2 oz, 3 oz, 4 oz.
Multilayer stack up: stack up, controlled impedence.
Pcb size: unit size, panel size, tooling strips, tooling holes and fudicials.
Min hole size: 0.2mm
(shape tolerance¡à 0.13mm, hole tolerance: pth¡à 0.075mm; npth: ¡à 0.05mm)
Min line width: 0.1mm
Min line spacing: 0.1mm
Solder mask color: green, blue, red, black, yellow, white
Legend color: white, yellow, black, blue, red
Surface finished: hal(tin / lead), hal(lead free), immersion gold, immersion silver,
Immersion tin, gold plated(soft gold), osp(entek).
Certificate: rohs, sgs, ukas, iso14001, dnv, ul
Profiling: cnc, routing, punching, beveling, v-cut, v-score, counter sink.
Test: e-test, fixture, fly-test.
Special technique: buried and blind vias, controlled impedance, bga.

We have:
Advanced equipment
Reliable quality
Reasonable price
High output
Quick delivery
Unlimited ordering quantity


Package: vacuum package

Category:High TG PCB
Number of Layers:6 Layers
Material:IT180
Thickness:1.6mm±0.1mm
Surface Treatment:ENIG 3u"
Finished Copper:1oz
Min.Line Width/Space:3/3mil
Minimum Hole:0.15mm
Hole Copper:25um
Technical Features:Black Ink&Thick Gold&BGA
Applications:Communication&Compute

Layer: 1-24 layer rigid pcb
1. Material
Fr-4 (high tg 150c- 280c) , fr-1, fr-2, cem-1, cem-3, rogers, halogen free, aluminium base

2. Surface finish:
1). Hal, hal lead free, osp ( entek ), immersion gold, immersion tin/silver, flash gold
2). Solder mask: lpi, green/red/blue/yellow/black
3). Silkscreen: white, yellow carbon lnk: available peelable mask: available

3. Board thickness: from min. 0.2mm to max. 6.0mm
4. Copper thickness: 18um ( 0.5 oz )---175um ( 4 oz )
5. Conductor width and spacing: min. 0.08mm
6. Drill hole: min. 0.2mm (8mil)
7. Tolerance:

1).Hole diameter: +/-0.05mm for pth, +/-0.025mm for npth
2).Hole position: +/-0.025mm
3).Outline: +/-0.1mm

8. Pth wall thickness : 0.02mm
9. Min. S/m bridge: 0.12mil

Flexible pcbs are manufactured on a substrate of polyimide, and are free to bend, which
Allows the installation of such boards in places, as well as use them as a flexible
Connector. Flexible boards allow increased density mounting of electronic devices,
Effectively using 3-d space.

Basic materials: polyimide
Thickness: 12.5 - 200 microns
Surface finish: tin immersion and gold flash

Layer: 1-24 layer rigid pcb
1. Material
Fr-4 (high tg 150ípc- 280ípc) , fr-1, fr-2, cem-1, cem-3, rogers, halogen free, aluminium base

2. Surface finish:
1). Hal, hal lead free, osp ( entek ), immersion gold, immersion tin/silver, flash gold
2). Solder mask: lpi, green/red/blue/yellow/black
3). Silkscreen: white, yellow carbon lnk: available peelable mask: available

3. Board thickness: from min. 0.2mm to max. 6.0mm

4. Copper thickness: 18um ( 0.5 oz )---175um ( 4 oz )

5. Conductor width and spacing: min. 0.08mm

6. Drill hole: min. 0.2mm (8mil)

7. Tolerance:
1).Hole diameter: +/-0.05mm for pth, +/-0.025mm for npth
2).Hole position: +/-0.025mm
3).Outline: +/-0.1mm

8. Pth wall thickness : 0.02mm

9. Min. S/m bridge: 0.12mil

Our Product Range
4-28 layer of high-precision impedance, blind & buried layers, HDI boards, high frequency board,
halogen-free boards, high-TG boards, aluminum, copper, iron base and ceramic-based circuit board,
1-6 layer flexible circuit board ( FPC) and rigid-flex flexible board, and other high-tech products.

PCB Process Capability
processing layers: 1- 30 layers
Finished thickness: 0.008 "~ 0.24" (0.20mm ~ 6.0mm)
Minimum aperture: 6mil (0.15mm)
Minimum line width / spacing: 3-4 mil (0.076-0.10mm)
Maximum board size: Single & Double 22 "x 43" (550 x1100mm), Multi-layer 22 "x 25" (550mm x 640mm)
Impedance Control: ± 10%
Surface Treatment: OSP, HASL, Electric Nickel / Gold, Chemical nickel / gold, lead-free HASL , Gold finger,
immersion Silver, Immersion Tin.
Base materials: FR4 ( ShengYi, KB, International), high TG (TG150, TG170), halogen-free board (Halogen-free),
High frequency plate (Rogers, Teflon, Taconic), made PTFE (PTFE), AL aluminum plate (Berquist, Al-made basis),
copper (Cu Base), Iron (Fe Base), Ceramic substrate (Ceramic Base)