High-Tg Thick Copper Board(High Tg Pcb Board)

We just processed in a large batch of chipsets. I posted below current inventory and attached pictures of each type of chipset. Please review and let me know your interest/offer.

Chipset 1 (H61) â?? 3,350 units
Chipset 2 (H81) â?? 2,206 units
Chipset 3 (H55) â?? 436 units
Chipset 4 (B250) â?? 1,600 units
Chipset 5 (SR406) â?? 345 units


Thank you,

Divanti Group

we are leading manufacturer & exporter of standoff/spacers as per requirement or Drawing

High-TG PCB High Temperature PCB fr4 Material
The Glass Transition Temperature (Tg) is one of the most important properties of any epoxy and is the temperature region where the polymer transitions from a hard, glassy material to a soft, rubbery material.
Circuit board material must flame-resistant, it canâ??t be burned at a certain temperature and only be soften. The temperature point is called the glass transition temperature (Tg).
The higher Tg point means higher temperature requirement during lamination. And the Aluminum clad Circuit Boards will be hard and crisp, which will affect hole and the electrical properties.
Ordinary PCB materials at high temperatures, not only will be soften, deformation, melting and other phenomena, but also the mechanical and electrical properties decline sharply.
General fr4 Tg is 130-140 centigrade, moderate Tg is greater than 150-160 centigrade, High-Tg is greater than 170 degrees.
The higher of Tg, the better performance of PCB heat resistance, moisture resistance, chemical resistance, stability and other characteristics.
FR4 is a code name for grade of Epoxy Glass material.
Tg means Glass Transition Temperature.
When the working temperature reaches to the melting point, that means the temperature exceeds the Tg value, the status of pcb material will be changed from glassy to liquid, which will affect the function of pcb. And this value is related to the stability of the pcb dimension.
As usual, made with Tg â?¥ 170â?? pcb material, which is called high Tg printed circuit board. With the rapid development of the electronics industry, high Tg material is widely used in computer, communication equipment, precise apparatus and instrument and etc.

High tg pcb

Base material: fr4, fr1, fr2, ceramics, aluminum, rogers, f4b, f4bk, f4bt, tp, pf, cem-1, cem-3, etc.
Board thickness: 0.30 to 3.20mm (12 to 26mil)
Copper thickness: 0.50 to 5 ounce
Solder mask: lpi solder mask, conventional solder mask, peelable solder mask, uv solder mask
Minimum line width: 0.1mm (4mil)
Minimum line space: 0.1mm (4mil)
Minimum hole diameter: 0.25mm (10mil)
Pth hole diameter tolerance: +/-0.076mm (+/-3mil)
Npth hole diameter tolerance: +/-0.03mm (+/-1.2mil)
Maximum board size: 460 x 620mm (18 x 24)
Board finishing type: hot air leveling, soft gold, hard gold, immersion gold, gold fingers

Tg 170, packing :vacuum packing in carton

Double side high TG PCB assembly 0201 components
PCBA Supplier, pcba processing manufacturer
4 YAMAHA High-speed SMT Lines
6 million daily SMT placements capability
400,000 daily DIP placements capability
500Ã?600 mm Maximum Board Size
0.25"x 0.25" Minimum Board Size
450 mm Max. Width for Wave-Solder
Passives Components Down to 0201 Size BGA and VFBGA Leadless Chip Carrier/CSP Double-Sided SMT Assembly Fine Pitch to 08 Mil BGA Repair and ReballPart Removal and Replacement
SMT and DIP/X-RAY Inspection/AOI Testing/In-circuit-test (ICT)/Flying Probe/Function Test/Burn-in/Finished products assembly

Place of Origin
UNITED STATE


Model Number
20024

Packaging and delivery
Packaging Details
As buyers requirements

Port
worldwide

Supply Ability
Supply Ability
5000 Kilogram/Kilograms per Week

Number of Layers:
1-64-Layer
Base Material:
FR4,High-TG ,Rogers,Nelco,RCC,PTFE
Copper Thickness:
0.3-12oz
Board Thickness:
0.6-10mm
Min. Hole Size:
0.03mm
Min. Line Width:
0.035
Min. Line Spacing:
0.035
Surface Finishing:
HASL, Immersion Gold/Tin/Silver ,OSP
Board Size:
5mm*5mm-610mm*1100mm

2 layer with 10 oz / 350um copper
Material: fr4 (tg 135'c)
Finished thickness: 1.6mm
Finished copper: 10 /10 oz
Min hole size: 2.0 mm
Without solder mask.
Surface: osp

Category:High TG PCB
Number of Layers:6 Layers
Material:IT180
Thickness:1.6mm±0.1mm
Surface Treatment:ENIG 3u"
Finished Copper:1oz
Min.Line Width/Space:3/3mil
Minimum Hole:0.15mm
Hole Copper:25um
Technical Features:Black Ink&Thick Gold&BGA
Applications:Communication&Compute