Layer: 1-24 layer rigid pcb
1. Material
Fr-4 (high tg 150c- 280c) , fr-1, fr-2, cem-1, cem-3, rogers, halogen free, aluminium base

2. Surface finish:
1). Hal, hal lead free, osp ( entek ), immersion gold, immersion tin/silver, flash gold
2). Solder mask: lpi, green/red/blue/yellow/black
3). Silkscreen: white, yellow carbon lnk: available peelable mask: available

3. Board thickness: from min. 0.2mm to max. 6.0mm
4. Copper thickness: 18um ( 0.5 oz )---175um ( 4 oz )
5. Conductor width and spacing: min. 0.08mm
6. Drill hole: min. 0.2mm (8mil)
7. Tolerance:

1).Hole diameter: +/-0.05mm for pth, +/-0.025mm for npth
2).Hole position: +/-0.025mm
3).Outline: +/-0.1mm

8. Pth wall thickness : 0.02mm
9. Min. S/m bridge: 0.12mil