FR4 High Tg 34 layer ATE,Burn-in IC or semiconductor test PCB:
Thickness 4.8mm,min hole diameter:0.15mm,Aspect ratio:32:1,size:440*440mm,surface finishing:panel gold plating+hard gold plating,min hole wall to conductor:4.8mil, via hole:vacuum resin plugging
Place of origin: taiwan
other gold, immersion tin & silver, & osp
Maximum layer count, prototype: 40 or more layers
Max. Board size: 18 x 24 inches
Bow and twist: max 0.1%
Drilled via size: 2 mils
Annular ring: 1.5 mils
Inner line width: <0.05 mm (2 mils)
Min. Finished trace space: 3 mils
Min. Inner trace space: 1.5 mils
Smt pitch: 0.3 mm
Copper to board edge: 5 mils
Place of origin: taiwan
Brand name: fr4, rogers, isola, etc.
Copper thickness: 0.45 mils - 14 mils
Board thickness: 280 mils (max finished board)
Min. Hole size: <0.15 mm (<6 mils) min outer layer drilled hole diameter
Min. Line width: <0.05 mm (2 mils) inner
Min. Line spacing: 2/2 mils
Surface finishing: hasl, pb-free & other gold, immersion tin & silver, & osp
Maximum layer count, prototype: 40 or more layers
Max. Board size: 18 x 24 inches
Bow and twist: max 0.1%
Drilled via size: 2 mils
Annular ring: 1.5 mils
Inner line width: <0.05 mm (2 mils)
Min. Finished trace space: 3 mils
Min. Inner trace space: 1.5 mils
Smt pitch: 0.3 mm
Copper to board edge: 5 mils
Place of origin: taiwan
Laminate: fr4, rogers, isola, etc.
old, immersion tin & silver, & osp
Maximum layer count, prototype: 40 or more layers
Max. Board size: 18 x 24 inches
Bow and twist: max 0.1%
Drilled via size: 2 mils
Annular ring: 1.5 mils
Inner line width: <0.05 mm (2 mils)
Min. Finished trace space: 3 mils
Min. Inner trace space: 1.5 mils
Smt pitch: 0.3 mm
Copper to board edge: 5 mils
