Place of origin: taiwan
Brand name: fr4, rogers, isola, etc.
Copper thickness: 0.45 mils - 14 mils
Board thickness: 280 mils (max finished board)
Min. Hole size: <0.15 mm (<6 mils) min outer layer drilled hole diameter
Min. Line width: <0.05 mm (2 mils) inner
Min. Line spacing: 2/2 mils
Surface finishing: hasl, pb-free & other gold, immersion tin & silver, & osp
Maximum layer count, prototype: 40 or more layers
Max. Board size: 18 x 24 inches
Bow and twist: max 0.1%
Drilled via size: 2 mils
Annular ring: 1.5 mils
Inner line width: <0.05 mm (2 mils)
Min. Finished trace space: 3 mils
Min. Inner trace space: 1.5 mils
Smt pitch: 0.3 mm
Copper to board edge: 5 mils
Layers : Sample 1~32 / Mass Production 1~20
Size :Max shipping size is 600mmx550mm , +/-0.15mm
Finished Board Thickness: Min 0.4mm(4L)/0.6mm(6L),+/-0.1mm
(Max) 3.6mm(2.2~3.6mm depends on material), +/-10%
Copper Thickness :1/3~5oz (Depends on material)
Impedance Control :+/-10%
Via Holes (Min) : Mechanical Drill:0.2mm / Micro Via:0.1mm
PTH+/-0.075mm NPTH +/-0.05mm
Aspect Ratio : Sample :10:1 / Mass Production :8:1
Min Trace(Width/Spacing) : Internal 0.075mm / External 0.075mm
The tolerance followed by IPC-6012
Advance Process : Blind Routing Cavity,Coil Board,Plug Hole With Epoxy,Half Hole Plated
Spacing between Pads : Min :8 mil
Minimum Circuit Trace Width/Space: 2.7/2.7mil
The Minimum Via Size : 0.15mm
The Minimum legend Height/Width: 0.5mm/0.12mm
Surface Finishing: HASL-LF, ENIG,ENEPIG,OSP,Gold Finger,Hard Gold Plating,Immersion Silver,Immersion Tin
Special Technology: Blind&buried via, Via In Pad,Backdrill,Small BGA Pad,Impedance control,Heavy Copper,Copper Filled Vias,Countersink hole,Depth Milling
Material Type: FR4,Metal Core,Halogen Free FR4,Rogers,PTFE,Arlon,Nelco,Polyimide
Maximum Panel Dimension: 1200mm x 600mm
Final Board Thickness: 0.4mm ~ 6.0mm
Final Copper Thickness: HOZ 1OZ 2OZ 3OZ 4OZ 6OZ 10OZ
FR4 Substrate Thickness: 0.1mm 0.2mm 0.3mm 0.4mm 0.5mm 0.6mm 0.8mm 1.0mm 1.2mm 1.5mm 2.0mm 2.36mm
Shaping: CNC Routing,Punching,V-CUT, Depth milling, Castellation
Special Hole: Blind&buried hole,Depth milling,T-slot,Countersink hole
About King Sun PCB:
King Sun PCB Technology is a manufacturing enterprise that be engaged in high density interconnector multilayer, various types PCB prototype, small and mass production PCB produce.
Our products included: HDI PCBs, Via in PAD PCBs, ENEPIG PCBs, Castellated Holes PCBs, Small BGA ball PCBs, Heavy copper foil PCBs, High Frequency PCBs, Rigid-Flex PCBs.Products are used in wide range of IoT industries, Hi-Tech industries, Power supply, Telecommunication, Computer, Industrial control, Digital products, Science and Education instruments, Medical instruments, Automobile, etc.
In 2005,we expanded our products to develop and manufacture metal core base PCBs(MCPCB) ,now commonly used in LED lighting and Automobile industry. MCPCBs first class material ensure reliability and play a major role in excellent heat dissipation. It greatly increase longevity of LED Lighting. now we have gained reputable recognition in famous LED Lighting companies.
King Sun concentrates on high quality, fast and satisfied service in summary, our service offering are:
ï?§ Quick-turn around prototypes fabrication.
ï?§ Low cost for mass productions orders.
ï?§ MCPCB fabrication.
ï?§ PCB prototype assembly
ï?§ Function test after PCB assembly
ï?§ Stencil making
ï?§ Components source
Smartphone RFPCB /Flexible PCB
Jinsung Electronics is developing its competitive RF & FPCB products to keep pace with the rapid changes in smart phones & portable electronics.
Jinsung Electronics, founded in 1995, manufactures RF/Flexible PCB, which are the most basic main board of electronic products that are closely related to our daily life.
