Huaxiang Ccircuit Technoology Ltd.

Layer: 1-24 layer rigid pcb
1. Material
Fr-4 (high tg 150c- 280c) , fr-1, fr-2, cem-1, cem-3, rogers, halogen free, aluminium base

2. Surface finish:
1). Hal, hal lead free, osp ( entek ), immersion gold, immersion tin/silver, flash gold
2). Solder mask: lpi, green/red/blue/yellow/black
3). Silkscreen: white, yellow carbon lnk: available peelable mask: available

3. Board thickness: from min. 0.2mm to max. 6.0mm
4. Copper thickness: 18um ( 0.5 oz )---175um ( 4 oz )
5. Conductor width and spacing: min. 0.08mm
6. Drill hole: min. 0.2mm (8mil)
7. Tolerance:

1).Hole diameter: +/-0.05mm for pth, +/-0.025mm for npth
2).Hole position: +/-0.025mm
3).Outline: +/-0.1mm

8. Pth wall thickness : 0.02mm
9. Min. S/m bridge: 0.12mil

Flexible pcbs are manufactured on a substrate of polyimide, and are free to bend, which
Allows the installation of such boards in places, as well as use them as a flexible
Connector. Flexible boards allow increased density mounting of electronic devices,
Effectively using 3-d space.

Basic materials: polyimide
Thickness: 12.5 - 200 microns
Surface finish: tin immersion and gold flash

Layer: 1-24 layer rigid pcb
1. Material
Fr-4 (high tg 150ípc- 280ípc) , fr-1, fr-2, cem-1, cem-3, rogers, halogen free, aluminium base

2. Surface finish:
1). Hal, hal lead free, osp ( entek ), immersion gold, immersion tin/silver, flash gold
2). Solder mask: lpi, green/red/blue/yellow/black
3). Silkscreen: white, yellow carbon lnk: available peelable mask: available

3. Board thickness: from min. 0.2mm to max. 6.0mm

4. Copper thickness: 18um ( 0.5 oz )---175um ( 4 oz )

5. Conductor width and spacing: min. 0.08mm

6. Drill hole: min. 0.2mm (8mil)

7. Tolerance:
1).Hole diameter: +/-0.05mm for pth, +/-0.025mm for npth
2).Hole position: +/-0.025mm
3).Outline: +/-0.1mm

8. Pth wall thickness : 0.02mm

9. Min. S/m bridge: 0.12mil

Technical Capability:

Product type

FR4+FCCL(Flexible Copper Clad Laminate)rigid flex PCB

Material

FR4+FCCL

Field of application

military industrial

Layers/thickness

4L/1.2mm

Line Space/width

6/6mil

Surface treatment

ENIG

Minimum hole dia.

0.2mm

Technical feature

special material,rigid-flex technology

We OffeCircuit Boardr a Full Range of Printed Circuit Board Capabilities to Fit All of Your PCB Needs

Process Item Craft Capacity
Prepares materials Base Material FR4, CEM-1, Aluminium, High Tg Material, Halogen-free Material
Lamination press Layer Count 1-12Layers
Thickness 0.2-3.0mm
Drill Min.Hole Diameter 0.15mm (mechanical drill), 0.1MM (laser drill)
PTH Diameter Tolerance + / - 3mil
NPTH Diameter Tolerance + / - 2mil
Outer layer Min.Line/Space 3.5mil/3.5mil
Copper Thickness 1- 6oz
Impendence Impedance tolerance ±10% (±5%(Need assessment)
Solder Masking Min.Solder Dam 0.1mm
Min.Solder Mask Opening 0.075mm
Color Green, White, Red, Yellow, Black, Blue
Surface Treatment LF-HASL, OSP,Ni/Au Enig,Immersion Tin, Immersion Silver, carbon oil;

Out-Line Profiling Profile Tolerance + / - 0.12MM
V-cut Remain Thickness Tolerance + / - 0.1MM
V-cut Angle Tolerance + / - 5°
Testing E-Testing 100% E-Testing (High Voltage Testing); Flying Probe Testing
Final Product Thickness Tolerance + / - 10%
Warpage Tolerance + / - 0.75%

Lead Time Double layer PCB Multilayer PCB Mass production
Normal 6 work days Normal 8 work days Double layer 9-12 work days
Urgent 3 work days Urgent 6 work days Multilayer 12-15 work days
Email:sales5@(keyoupcb.com)

Learn more from our website:www.keyoucircuit.com

ADD:Room K221,jinhetian Center,QINGHU AREA,SHENZHEN, Guangdong,China

PCBA Capability

Capability - SMT

Lines

9 (5 Yamaha, 4 KME)

Capacity

52 million placements per month

Max Board Size

457 X 356mm. (18 x 14)

Min Component size

0201 54 sq. mm. (0.084 sq. inch), long connector, CSP, BGA, QFP

Speed

0.15 sec/chip, 0.7 sec/QFP

Capability - PTH

Insertion Type

# of Lines

Capacity (points/mth)

Max Board Size

Lead Pitch

Jumper Wire

3

6 million

330X250 mm (13 x 9.8)

5-30 mm

Axial

3

6 million

457x559 mm (18 x 22)

5-20 mm

Radial

3

9 million

457x559 mm (18 x 22)

0.36-21.5 mm

Wave Soldering

Wave Soldering

2

Max board width

400 mm

Type

Dual wave

Pbs Status

Lead-free line support

Max temp

399 degree C

Spray flux

add-on

Pre-heat zones

3

Layer: 1 to 16 layers
Material type: FR-4,CEM-3,High TG,FR4 Halogen Free,RIGID-FLEX
Board thickness: 0.20mm to 3.4mm
copper thickness: 0.5 OZ to 6 OZ
copper thickness in hole: >25.0 um(>1mil)
Max size of finish board: 700*460mm
Min.Drilled Hole Size: 1.0mm
Min.Line Width: 3mil
Min.Line Spacing: 3mil
Surface finishing:
HASL/HASL lead free,HAL,Chemical tin,Chemical Gold,

Immersion Silver/Gold,OSP,Gold plating

Solder Mask Color: Green/Yellow/Black/White/Red/Blue
Shape tolerance: ±4mil
Hole tolerance: PTH:±3mil,NPTH:±2mil
Package:
Inner paking/Plastic bag,Outer packing:Standard

carton packing

Certificate: UL,SGS, ISO 9001:2008,IATF16949
Special requirements: Buried and blind vias+controlled impedance+BGA
Profiling: Punching,Routing, V-CUT,Beveling