Find Verified Solar Wafer Cutting Wire Suppliers, Manufacturers and Wholesalers

Solar Wafer Cutting wire Silicon Cutting Sawing Wire
Sawing wire , also called ultra fine wire,is cold drawing high strengh brass plated steel wire with high carbon.
It can be used for cutting high hardness of single crystal line silicon,poly crystal line silicon,quartz material,etc.
(1)Sawing wire is a high grade steel wire that can be used to cut a wide range of products.It serves as the abrasive carrier in a Multi Wire Saw.
(2)The technique finds its origin in the world of solar cells. From the mid eighties, this technology was developed to decrease kerf loss and increase productivity.
(3)In the early nineties the method was introduced for slicing silicon ingots to wafers for the electronics industry. Since then the technique has been more and more introduced for cutting other hard and brittle materials as well.
(4)Saw wire is used to cut a wide variety of products, such as silicon, germanium, gallium aresenide, quartz, indium phosphide, to name only a few.
( 5 )Saw wire is mostly used in the production of solar cells. The use of photovoltaic energy is increasing, as humanity becomes more and more aware of the scarcity of the natural resources.

Solar Wafer Cutting wire Silicon Cutting Sawing Wire
Sawing wire , also called ultra fine wire,is cold drawing high strengh brass plated steel wire with high carbon.
It can be used for cutting high hardness of single crystal line silicon,poly crystal line silicon,quartz material,etc.
(1)Sawing wire is a high grade steel wire that can be used to cut a wide range of products.It serves as the abrasive carrier in a Multi Wire Saw.
(2)The technique finds its origin in the world of solar cells. From the mid eighties, this technology was developed to decrease kerf loss and increase productivity.
(3)In the early nineties the method was introduced for slicing silicon ingots to wafers for the electronics industry. Since then the technique has been more and more introduced for cutting other hard and brittle materials as well.
(4)Saw wire is used to cut a wide variety of products, such as silicon, germanium, gallium aresenide, quartz, indium phosphide, to name only a few.
( 5 )Saw wire is mostly used in the production of solar cells. The use of photovoltaic energy is increasing, as humanity becomes more and more aware of the scarcity of the natural resources.

Advantage of
Sawing Wire for Solar Wafer Cutiing
Very thin and tensile wires of low keff loss
Hence more wafters per cut and less fractures
Make higher productivity
Tight diameter and ovality tolerances
A wide range of spool types
An advanced winding technology

Sawing wire for multi sawing solar wfter cutting
Item: Sawing wire for multi-wire sawing
Ultra Fine Wire Saw For Cutting High Hardness of Monocrystalline Silicon
Shape:wire
Material: Imported C-steel
Coating:Brass,combinations
Number of wires:1 wire
Other Name: Solar Wafer Cutting wire Silicon Cutting Sawing Wire
Diameter:65um-350um available

Solar Wafer Cutting wire Silicon Cutting Sawing Wire
Sawing wire , also called ultra fine wire,is cold drawing high strengh brass plated steel wire with high carbon.
It can be used for cutting high hardness of single crystal line silicon,poly crystal line silicon,quartz material,etc.
(1)Sawing wire is a high grade steel wire that can be used to cut a wide range of products.It serves as the abrasive carrier in a Multi Wire Saw.
(2)The technique finds its origin in the world of solar cells. From the mid eighties, this technology was developed to decrease kerf loss and increase productivity.
(3)In the early nineties the method was introduced for slicing silicon ingots to wafers for the electronics industry. Since then the technique has been more and more introduced for cutting other hard and brittle materials as well.
(4)Saw wire is used to cut a wide variety of products, such as silicon, germanium, gallium aresenide, quartz, indium phosphide, to name only a few.
( 5 )Saw wire is mostly used in the production of solar cells. The use of photovoltaic energy is increasing, as humanity becomes more and more aware of the scarcity of the natural resources.
Advantage of
Sawing Wire for Solar Wafer Cutiing
--------
Very thin and tensile wires of low keff loss
Hence more wafters per cut and less fractures
Make higher productivity
Tight diameter and ovality tolerances
A wide range of spool types
An advanced winding technology
INTRODUCTION:
Solar Wafer Cutting wire Silicon Cutting Sawing Wire
17 years of history in steel wire transforming and coating
Listed on Shenzhen A stock market in 2007
An annual output of 10,000 tons of sawing wire
ISO/TS 16949 And ISO9002 certificated
Can provide all kinds of all kinds of the length of the wire, the line length subject only to the spool take-up capacity limit. H wheel type mainly includes NTC210 type, BS200, BS64, BS126, etc. According to customer needs to provide other specification size of h wheel.

Sawing wire for multi sawing solar wfter cutting
Item: Sawing wire for multi-wire sawing
Ultra Fine Wire Saw For Cutting High Hardness of Monocrystalline Silicon
Shape:wire
Material: Imported C-steel
Coating:Brass,combinations
Number of wires:1 wire
Other Name: Solar Wafer Cutting wire Silicon Cutting Sawing Wire
Diameter:65um-350um available
Advantage of
Sawing Wire for Solar Wafer Cutiing

Hengxing 0.1mm 0.12mm Brass Coated Solar Wafer Cutting Wire
Sawing wire , also called ultra fine wire,is cold drawing high strengh brass plated steel wire with high carbon.
It can be used for cutting high hardness of single crystal line silicon,poly crystal line silicon,quartz material,etc.
(1)Sawing wire is a high grade steel wire that can be used to cut a wide range of products.It serves as the abrasive carrier in a Multi Wire Saw.
(2)The technique finds its origin in the world of solar cells. From the mid eighties, this technology was developed to decrease kerf loss and increase productivity.
(3)In the early nineties the method was introduced for slicing silicon ingots to wafers for the electronics industry. Since then the technique has been more and more introduced for cutting other hard and brittle materials as well.
(4)Saw wire is used to cut a wide variety of products, such as silicon, germanium, gallium aresenide, quartz, indium phosphide, to name only a few.
( 5 )Saw wire is mostly used in the production of solar cells. The use of photovoltaic energy is increasing, as humanity becomes more and more aware of the scarcity of the natural resources.
http://en.hengxingchinese.com/
Hengxing company website: https://hengxingsteelwire.com/
Email contact US:wmsahttp://en.hengxingchinese.com/

Item: 0.1mm-0.7mm Brassed Coated Sawing Steel Wire for Solar Wafer Cutting
Shape:wire
Material: Imported C-steel
Coating:Brass,combinations
Number of wires:1
Diameter:65um-350um available
Very thin and tensile wires of low keff loss
Hence more wafters per cut and less fractures
Make higher productivity
Tight diameter and ovality tolerances
A wide range of spool types
An advanced winding technology

Hengxing 0.1mm 0.12mm Brass Coated Solar Wafer Cutting Wire
Sawing wire , also called ultra fine wire,is cold drawing high strengh brass plated steel wire with high carbon.
It can be used for cutting high hardness of single crystal line silicon,poly crystal line silicon,quartz material,etc.
(1)Sawing wire is a high grade steel wire that can be used to cut a wide range of products.It serves as the abrasive carrier in a Multi Wire Saw.
(2)The technique finds its origin in the world of solar cells. From the mid eighties, this technology was developed to decrease kerf loss and increase productivity.
(3)In the early nineties the method was introduced for slicing silicon ingots to wafers for the electronics industry. Since then the technique has been more and more introduced for cutting other hard and brittle materials as well.
(4)Saw wire is used to cut a wide variety of products, such as silicon, germanium, gallium aresenide, quartz, indium phosphide, to name only a few.
( 5 )Saw wire is mostly used in the production of solar cells. The use of photovoltaic energy is increasing, as humanity becomes more and more aware of the scarcity of the natural resources.

Advantage of Hengxing 0.1mm 0.12mm Brass Coated Solar Wafer Cutting Wire
--------
Very thin and tensile wires of low keff loss
Hence more wafters per cut and less fractures
Make higher productivity
Tight diameter and ovality tolerances
A wide range of spool types
An advanced winding technology

Hengxing 0.1mm 0.12mm Brass Coated Solar Wafer Cutting Wire
17 years of history in steel wire transforming and coating
Listed on Shenzhen A stock market in 2007
An annual output of 10,000 tons of sawing wire
ISO/TS 16949 And ISO9002 certificated

Hengxing 0.1mm 0.12mm Brass Coated Solar Wafer Cutting Wire
Item: 0.1mm-0.7mm Brassed Coated Sawing Steel Wire for Solar Wafer Cutting
Shape:wire
Material: Imported C-steel
Coating:Brass,combinations
Number of wires:1
Diameter:65um-350um available
Advantage of Hengxing 0.1mm 0.12mm Brass Coated Solar Wafer Cutting Wire
--------
Very thin and tensile wires of low keff loss
Hence more wafters per cut and less fractures
Make higher productivity
Tight diameter and ovality tolerances
A wide range of spool types
An advanced winding technology

Advantage of
Sawing Wire for Solar Wafer Cutiing
Very thin and tensile wires of low keff loss
Hence more wafters per cut and less fractures
Make higher productivity
Tight diameter and ovality tolerances
A wide range of spool types
An advanced winding technology

Sawing wire , also called ultra fine wire,is cold drawing high strengh brass plated steel wire with high carbon.
It can be used for cutting high hardness of single crystal line silicon,poly crystal line silicon,quartz material,etc.
(1)Sawing wire is a high grade steel wire that can be used to cut a wide range of products.It serves as the abrasive carrier in a Multi Wire Saw.
(2)The technique finds its origin in the world of solar cells. From the mid eighties, this technology was developed to decrease kerf loss and increase productivity.
(3)In the early nineties the method was introduced for slicing silicon ingots to wafers for the electronics industry. Since then the technique has been more and more introduced for cutting other hard and brittle materials as well.
(4)Saw wire is used to cut a wide variety of products, such as silicon, germanium, gallium aresenide, quartz, indium phosphide, to name only a few.
( 5 )Saw wire is mostly used in the production of solar cells. The use of photovoltaic energy is increasing, as humanity becomes more and more aware of the scarcity of the natural resources.

Hengxing company website: https://hengxingsteelwire.com/
Email contact US:wmsale@hxkjgf.com

Advantage of
Sawing Wire for Solar Wafer Cutiing
--------
Very thin and tensile wires of low keff loss
Hence more wafters per cut and less fractures
Make higher productivity
Tight diameter and ovality tolerances
A wide range of spool types
An advanced winding technology

Hengxing Solar Wafer Cutting Diamond Multi-Wire Sawing Ultra Fine Steel Saw Wire
Sawing wire , also called ultra fine wire,is cold drawing high strengh brass plated steel wire with high carbon.
It can be used for cutting high hardness of single crystal line silicon,poly crystal line silicon,quartz material,etc.
(1)Sawing wire is a high grade steel wire that can be used to cut a wide range of products.It serves as the abrasive carrier in a Multi Wire Saw.
(2)The technique finds its origin in the world of solar cells. From the mid eighties, this technology was developed to decrease kerf loss and increase productivity.
(3)In the early nineties the method was introduced for slicing silicon ingots to wafers for the electronics industry. Since then the technique has been more and more introduced for cutting other hard and brittle materials as well.
(4)Saw wire is used to cut a wide variety of products, such as silicon, germanium, gallium aresenide, quartz, indium phosphide, to name only a few.
( 5 )Saw wire is mostly used in the production of solar cells. The use of photovoltaic energy is increasing, as humanity becomes more and more aware of the scarcity of the natural resources.

Hengxing company website: https://hengxingsteelwire.com/
Email contact US:wmsale@hxkjgf.com

Sawing wire , also called ultra fine wire,is cold drawing high strengh brass plated steel wire with high carbon.
It can be used for cutting high hardness of single crystal line silicon,poly crystal line silicon,quartz material,etc.
(1)Sawing wire is a high grade steel wire that can be used to cut a wide range of products.It serves as the abrasive carrier in a Multi Wire Saw.
(2)The technique finds its origin in the world of solar cells. From the mid eighties, this technology was developed to decrease kerf loss and increase productivity.
(3)In the early nineties the method was introduced for slicing silicon ingots to wafers for the electronics industry. Since then the technique has been more and more introduced for cutting other hard and brittle materials as well.
(4)Saw wire is used to cut a wide variety of products, such as silicon, germanium, gallium aresenide, quartz, indium phosphide, to name only a few.
( 5 )Saw wire is mostly used in the production of solar cells. The use of photovoltaic energy is increasing, as humanity becomes more and more aware of the scarcity of the natural resources.

Advantage of
Sawing Wire for Solar Wafer Cutiing
Very thin and tensile wires of low keff loss
Hence more wafters per cut and less fractures
Make higher productivity
Tight diameter and ovality tolerances
A wide range of spool types
An advanced winding technology
Sawing wire , also called ultra fine wire,is cold drawing high strengh brass plated steel wire with high carbon.
It can be used for cutting high hardness of single crystal line silicon,poly crystal line silicon,quartz material,etc.
(1)Sawing wire is a high grade steel wire that can be used to cut a wide range of products.It serves as the abrasive carrier in a Multi Wire Saw.
(2)The technique finds its origin in the world of solar cells. From the mid eighties, this technology was developed to decrease kerf loss and increase productivity.
(3)In the early nineties the method was introduced for slicing silicon ingots to wafers for the electronics industry. Since then the technique has been more and more introduced for cutting other hard and brittle materials as well.
(4)Saw wire is used to cut a wide variety of products, such as silicon, germanium, gallium aresenide, quartz, indium phosphide, to name only a few.
( 5 )Saw wire is mostly used in the production of solar cells. The use of photovoltaic energy is increasing, as humanity becomes more and more aware of the scarcity of the natural resources.
INTRODUCTION:
17 years of history in steel wire transforming and coating
Listed on Shenzhen A stock market in 2007
An annual output of 10,000 tons of sawing wire
ISO/TS 16949 And ISO9002 certificated
Can provide all kinds of all kinds of the length of the wire, the line length subject only to the spool take-up capacity limit. H wheel type mainly includes NTC210 type, BS200, BS64, BS126, etc. According to customer needs to provide other specification size of h wheel.

Advantage of
Sawing Wire for Solar Wafer Cutiing
Very thin and tensile wires of low keff loss
Hence more wafters per cut and less fractures
Make higher productivity
Tight diameter and ovality tolerances
A wide range of spool types
An advanced winding technology
Sawing wire for multi sawing solar wfter cutting
Item: Sawing wire for multi-wire sawing
Shape:wire
Material: Imported C-steel
Coating:Brass,combinations
Number of wires:1
Diameter:65um-350um available

Minicoco Wafer Cream Chocolate 82g

Product Origin : Indonesia

Key Specifications/Special Features : Food And Beverages, Biscuit, Wafer

Minimum Order : 1x20'F

Available flavour variants Cheese Cream, Chocolate Cream, Pink Lava Cream, Vanilla Cream, Raspberry Yogurt Cream, Peach Yogurt, Butter Caramel. Product is Manufactured by PT Kaldu Sari Nabati Indonesia.

Richeese Nabati Wafer & Rolls. Available in Vanilla & Pink Lava Flavor.

Available in Box, Tin, Pouch & Pack. Shelf Life = 12 Months. Language in Packaging = English, Bahasa Indonesia. Port of Loading: Semarang, Indonesia. Note: We could paste sticker on each pack should there is any additional information needed (importer name, information in other language, etc)

Available Flavors Chocolate, Black Forest, Tiramisu, Cheesecake. Packaging 40x30gr. Product is Manufactured by PT Manohara Asri.

Twister Snack Wafer roll
Available flavour Black, Black Vanilla, Chocolate, Cappuccino, Chocolate Cappuccino, Strawberry, Chocolate Vanilla. Packaging 24x45gr, 6x150gr, 20x80gr, 6x10x30gr, 10x12x20gr, 120x15gr. Product is Manufactured by PT. Perusahaan Industri Ceres.

Cho-Cho Wafer Stick
Available variants Chocolate Jar, Radja Jar, Ratu Chocolate, Ratu Strawberry, Cappuccino, Twin Chocolate Cappuccino Jar, Twin Chocolate Tiramisu Jar, Extra Chocolate Jar, Chocolate Premium, Semprong, Midi Chocolate Jar. Packaging 6x500gr, 6x670gr, 6x320gr, 12x260gr, 12x620gr, 6x350gr, 12x300gr. Product is Manufactured by PT Dolphin.