Number of layer: 1-56L
Base material: CEM-3, FR4, High TG FR4, Aluminum, Rogers, Arlon, etc.
Copper weight: 0.5OZ-6OZ(18mil-210mil)
Board thickness: 0.2-7.2mm(8mil-282mil)
Board types: Rigid, Flexible, Rigid-flex, Buried & Blind via board, HDI, etc.
Silk screen: White, blue, black, etc.
Solder mask: Green, black, red, blue, yellow, white, etc.
Surface finished: OSP, HASL, ENIG, ENEPIG, Silver, Gold plating, Hard gold, Immersion Tin, Immersion Gold, Carbon ink, etc.
Test: Fly Probe test, fixture test
Performance test: 100% electricity performance test
Min hole size: 0.2mm, Laser 0.1mm
Min line width/Space: 3mil/2mil
Outline profile: Rout, V-cut, Bridge, Stamp hole
Max panel size: 1000*600mm for Single and double side, 600*600mm for multi-layer
Min panel size: 10*10mm
Hole center position tolerance: ±0.05mm
Konrich Technologies has been providing printed circuit boards (pcb) to our customers throughout the world for many years.
With our rich experience in pcb manufacturing, we received a high recognition from customers. Good quality record, high on-time delivery rate and excellent customer service leaves a very good impression to our customers and also make us very competitive in the industry.
With the advantage of our strong R&D, we can produce many types of pcb boards - normal single, double to multilayer boards, HDI as well Flex & Rigid-flex boards. Our pcb boards are widely used in many fields - Industrial control, Communication, Medical, Security, Consumer Electronics, etc.
Commodity:Sodium persulfate
Molecular Formula : Na2S2O8
Molecular weight : 238.13
Description
Sodium persulfate is a white,crystalline,odourless salt.It is used as initiator for the Polymerization of monomers and as a strong oxidizing agent in many applications.It has the particular advantage of being almost non - hygroscopic,of having a particularly good storage stability as a result of its extremely high purity and of being easy and safe to handle.
Transportation
Road/Rail transport : GGVS,GGVE,ADR,RID/CLASS 5.1 Sea transport : GGV Sea/IMDG code : CLASS 5.1 Page 5185,UN no.1505
Water hazards class 1(slight water hazard)
All information is given in good faith,but without warranty,since the conditions of use are outside our control. Verification by the user is recommended.Freedom from patent restriction cannot be assumed.
Package
(1) In 25kgs net multiple paper bags with one PE bag inner
(2) In 25kgs net PE bags
(3) In 25kgs net woven bags with two PE bags inner
(4) In 1000kgs net big woven bags with one PE bag inner
The above package is also with a pallet 1000kgs each.
Storage
NPS(SPS) is not combustible but assists combustion materials due to release of oxygen.Provided it is stored under appropriate condition.It must be stored dry in closed containers and protected from direct sunlight,heat and humidity.Impurities such as dirt,rust or traces of metal and reductants may cause catalytic decomposition.The product as supplied or in solution needs to be handled with appropriate care.The eye,skin and clothes must be protected when working with NPS(SPS) as damp powder or aqueous solution has a bleaching and slightly corroding effect.
Application
Polymerization : Initiator for the emulsion or solution Polymerization of acrylic monomers,vinyl acetate,vinyl chloride etc.and for the emulsion co-polymerization of styrene,acrylonitrile,butadiene etc.
Metal treatment : Treatment of metal surfaces(e.g. in the manufacture of semiconductors;
cleaning and etching of printed circuits),activation of copper and aluminium surfaces.
Cosmetics : Essential component of bleaching formulations.
Paper : modification of starch,repulping of wet - strength paper.
Textile : Desizing agent and bleach activator - particularly for cold bleaching.(i.e.bleaching of Jeans).
Others :
- Chemical synthesis
- Water treatment(decontamination)
- Waste gas treatment,oxidative degradation of harmful substances(e.g.Hg)
- Disinfectant
ITEMS SPECIFICATIONS
Appearance white crystalline salt
Assay 99.0% w/w min
Active oxygen 6.65% w/w min
Chloride and chlorate(as CL) 0.005% w/w max
Ammonia (NH4) 0.05% w/w max
Manganese(Mn) 0.0001% w/w max
Iron(Fe) 0.001% w/w max
Heavy metals(as Pb) 0.001% w/w max
Moisture 0.05% w/w max
Decomposition of the product as supplied at above 65C
Recommended storage temperature Normal Temperature
Storage stability as from date of delivery 12 months
We have a design team with an industry experience of more than 12 years.We promise that each PCB is from our experienced designers, we will provide you perfect one-to-one service with the fastest delivery in the industry . (For example, we used to completed 10000pins PCB design excellently in 5 days.)
We have a design team with an industry experience of more than 12 years.We promise that each PCB is from our experienced designers, we will provide you perfect one-to-one service with the fastest delivery in the industry . (For example, we used to completed 10000pins PCB design excellently in 5 days.)
Okeir is a professional pcb manufacturer in Shenzhen,China, main business is PCB, fpc, rigid flexible pcb, turnkey pcba assembly service, We are committed to continuous improvement and customer satisfaction by providing exceptional service and technical support in the production and timely delivery of quality products, which include PCB assemblies, cable assemblies and full box assemblies and electronic/electrical components.welcome your inquiry by
1. Layer count: 1-30 layer.
2. Board thickness: 0.1-6.5MM
3. Impedance control:+/-5%
4. Min line width/space of outer layer 4/4mil
5. Min line width/space of inner layer : 3/3mil
6. Max size :24¡±x40¡±
7. Min hole dia. : 0.2mm (normal) , 0.075mm(laser drilling)
8. Toleranceof hole dia. : +/-2 mil
9. Max copper thickness : 8 oz
10. Base Materials :CEM1, FR1, FR4, Rogers, Arlon, Taconic etc.
11.Surface finishing : HAL, HAL Lead free,Immersion Gold,Immersion silver etc.
Thermoplastic PS has two representatives as GPPS and HIPS resin. In particular, PS HIPS plastic is more popular thanks to many advantages and applications. PS HIPS belongs to the group of hard, transparent resins that are easy to color, machined by suction lamination method and easy injection technology.
Common HIPS applications:
In packaging technology, it is used as a single-layer packaging for products that do not require strict antioxidant requirements.
Make coating HIPS plastic film to increase water vapor and gas resistance.
Making a printing surface to increase printing ability, making the outer plastic packaging with the ability to tear easily and create gloss.
Making bottle caps, pen cases, jewelry boxes, beer tanks, fresh food containers.
Making pharmaceutical bottles, pipes, cap for solvent containers.
Making high-frequency insulating materials, insulation clamps.
Making imitation leather sandals, textile packaging.
Pressing students' tables and chairs, pressed motorcycle details, yogurt cup, plastic candy tray.
MATERIAL: HIPS Regrind from post consumer materials ,Yes No Fr, NO pc abs, no iron, no circuit etc
CATEGORY: HIPS
TYPE: Regrind
SPECIFICATION: Hips from post consumer materials.Yes No Fr, NO pc abs, no iron, no circuit etc. Hips per month 52 mt
Origin: Bangladesh
LOADING WEIGHT: 24 Ton
FOB (USD/Ton): 650$ - 850$
Packaging: Jumbo Bag
Est. Shipping Time: 15, 30, 45 days
Konrich can produce many types of pcb boards - normal single, double to multilayer boards, HDI as well Flex & Rigid-flex boards. Our pcb boards are widely used in many fileds - Industrical control, Communication, Medical, Security, Consumer Electronics, etc.
PCB - printed circuit board
Our company is specialized in doublesided and multi-layer pcb, pcba, oem and so on. Our mission is to be the most successful pcb and pcba maker. We have advanced production machine and stable product quality. Also you can enjoy our considerate after-sales service.
You can search our webside to know our company and our product. If you are interested in our product, please have no hesitent to contact with us. We hope youf+re not too busy to know us.
Appearance
White or Light Yellow Emulsion
pH
6.5-8.5
Emulsion Lonic
Weak Anionic
Appropriate Thinner
10-30 â?? Water Thickening
Standard
GB/T 26527-2011
Organic Silicon Defoamer
1. The defoamer is composed of polysiloxane, modified polysiloxane, silicone resin, white carbon black, dispersing agent and stabilizer, etc.
2. At low concentrations, it can maintain good elimination bubble suppression effect.
3. Foam suppression performance is prominent
4. Easily dispersed in water
5. The compatibility of low and foaming medium
6. To prevent the growth of microorganisms
Advantage
It is composed of dispersant and stabilizer, low dosage, good acid and alkali resistance, stable chemical properties, easy to disperse in water, effectively prevent bacterial growth. The properties are stable during storage.
Application
1. Papermaking chemical pulping high temperature vacuum or pressure in the defoaming in pulp washing machine
2. When the alkali refining agent of textile industry, inhibit elimination of treatment before
3. Circuit board cleaning
4. Oil mud defoaming in the process of mining
5. Textile printing and dyeing processing
6. Agricultural chemicals
Our Product Range
4-28 layer of high-precision impedance, blind & buried layers, HDI boards, high frequency board,
halogen-free boards, high-TG boards, aluminum, copper, iron base and ceramic-based circuit board,
1-6 layer flexible circuit board ( FPC) and rigid-flex flexible board, and other high-tech products.
PCB Process Capability
processing layers: 1- 30 layers
Finished thickness: 0.008 "~ 0.24" (0.20mm ~ 6.0mm)
Minimum aperture: 6mil (0.15mm)
Minimum line width / spacing: 3-4 mil (0.076-0.10mm)
Maximum board size: Single & Double 22 "x 43" (550 x1100mm), Multi-layer 22 "x 25" (550mm x 640mm)
Impedance Control: ± 10%
Surface Treatment: OSP, HASL, Electric Nickel / Gold, Chemical nickel / gold, lead-free HASL , Gold finger,
immersion Silver, Immersion Tin.
Base materials: FR4 ( ShengYi, KB, International), high TG (TG150, TG170), halogen-free board (Halogen-free),
High frequency plate (Rogers, Teflon, Taconic), made PTFE (PTFE), AL aluminum plate (Berquist, Al-made basis),
copper (Cu Base), Iron (Fe Base), Ceramic substrate (Ceramic Base)
Two- to four-layer rigid-flex pcbs with fr4/hdi-pda laminate material
Key specifications/special features:
Number of layers: 2 to 4
Thickness: 12 mil only
Thermal performance: 30% better conduction than standard 0.062-inch fr4
New fr4 technology from photo circuit
New thermally conductive adhesive technology
Suitable for body through power train controller application
