Two- to four-layer rigid-flex pcbs with fr4/hdi-pda laminate material
Key specifications/special features:
Number of layers: 2 to 4
Thickness: 12 mil only
Thermal performance: 30% better conduction than standard 0.062-inch fr4
New fr4 technology from photo circuit
New thermally conductive adhesive technology
Suitable for body through power train controller application
Standard export carton
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