Layer: 1 to 32 layers
Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
Board thickness: 0.21mm to 7.0mm
Copper thickness: 0.5 OZ to 7.0 OZ
Copper thickness in hole: >25.0 um (>1mil)
Max. Board Size: 23 ¡¨¢ 25 (580mm¡¨¢900mm)
Min. Drilled Hole Size: 3mil (0.075mm)
Min. Line Width: 3mil (0.075mm)
Min. Line Spacing: 3mil (0.075mm)
Number of layer: 1-56L
Base material: CEM-3, FR4, High TG FR4, Aluminum, Rogers, Arlon, etc.
Copper weight: 0.5OZ-6OZ(18mil-210mil)
Board thickness: 0.2-7.2mm(8mil-282mil)
Board types: Rigid, Flexible, Rigid-flex, Buried & Blind via board, HDI, etc.
Silk screen: White, blue, black, etc.
Solder mask: Green, black, red, blue, yellow, white, etc.
Surface finished: OSP, HASL, ENIG, ENEPIG, Silver, Gold plating, Hard gold, Immersion Tin, Immersion Gold, Carbon ink, etc.
Test: Fly Probe test, fixture test
Performance test: 100% electricity performance test
Min hole size: 0.2mm, Laser 0.1mm
Min line width/Space: 3mil/2mil
Outline profile: Rout, V-cut, Bridge, Stamp hole
Max panel size: 1000*600mm for Single and double side, 600*600mm for multi-layer
Min panel size: 10*10mm
Hole center position tolerance: ±0.05mm
The PCB design capabilities of Lepos are as follows:
Maximum designed layers: 22 layers
Maximum PIN count: 48963
Minimum via: 8 MIL (4 Mil laser hole)
Minimum line width: 2.4 MIL
Minimum line spacing: 4 MIL
Maximum BGA count in a single PCB: 44
Minimum BGA PIN pitch: 0.4 mm
Highest speed signal: 10G CML differential signals.
Shortest lead time: 6 days for SI, placement, routing for 20000 pin PCB.
Supplier: Hdi PCBs, via in pad PCBs, enepig PCBs, castellated holes PCBs, small bga ball PCBs, heavy copper foil PCBs, high frequency PCBs, rigid flex PCBs
