The PCB design capabilities of Lepos are as follows:
Maximum designed layers: 22 layers
Maximum PIN count: 48963
Minimum via: 8 MIL (4 Mil laser hole)
Minimum line width: 2.4 MIL
Minimum line spacing: 4 MIL
Maximum BGA count in a single PCB: 44
Minimum BGA PIN pitch: 0.4 mm
Highest speed signal: 10G CML differential signals.
Shortest lead time: 6 days for SI, placement, routing for 20000 pin PCB.
Please ask detailed and specific
questions about Pricing, Minimum Order Quantity, Delivery Timelines etc. Detailed Messages
result in prompt responses.
