Adopting the most advanced microvia technology and ultra-fine line design, HDI PCB is a core substrate designed for miniaturised electronic products such as smartphones, wearable devices, medical electronics and high-end communication devices.
HDI PCB technical advantages and capabilities
1. High-order interconnect architecture Supports 1+N+1, 2+N+2, 3+N+3 and other multi-layer blind buried hole structure, the highest to achieve any-layer interconnect (Any-Layer), aperture diameter as low as 0.075mm, line width/spacing up to2mil/2mil (rigid board) and 0.025mm/0.025mm (flexible board), perfectly adapted to chip-scale packaging (CSP), system-in-package (SiP) and other cutting-edge technologies.
2. Ultra-thin dielectrics and fine lines Dielectric layer thickness is precisely controlled at 0.06-0.2mm, combined with ultra-thin copper foils (0.5-15oz inner layer, 0.5-10oz outer layer) to ensure signal integrity (SI) and power integrity (PI), and at the same time meet the requirements of chip-scale packaging (CSP), system-in-package (SiP) and other leading-edge technologies.Integrity (SI) and Power Integrity (PI), and at the same time meet the needs of thin and light designs (e.g., wearable devices, folding screen mobile phones).
3. Diversified surface treatment solutions Provide HASL (lead-free), ENIG (1-5" Au+80-200" Ni), electroless nickel-palladium-gold (ENEPIG), silver/tin immersion, etc., to adapt to harsh environments such as high temperature, high humidity, high frequency, etc., including hard gold plating (Au 1-50"/Ni 80-200" Ni).The hard gold plating (Au 1-50"/Ni 80-200") is especially suitable for connectors and wear-resistant contacts.
4. Flexible Circuits and Rigid-Flex Combination Flexible PCB (FPC) line width/spacing can be as thin as 0.025mm, with a bending radius as low as 0.1mm, supporting dynamic bending scenarios; Rigid-Flex Combination Boards (RBFBs) realise the seamless integration of rigid boards and flexible boards, and are widely used in drones, medical devices, and other applications. Widely used in drones, medical equipment and other high-reliability fields.
5. Mass production and quality assurance Monthly production capacity of 20,000 square metres, through the ISO 9001/14001/IATF 16949 system certification, equipped with AOI optical inspection, flying pin test and impedance control (�±10%) capabilities, to Ensure lead time and product yield.
Typical applications:
Motherboards and RF modules for smartphones/5G terminals
Wearable devices such as TWS headsets and smartwatches
High-end medical devices (e.g., portable ultrasound, implantable devices)
In-vehicle infotainment systems, ADAS sensor modules
Motherboards for high-performance servers and communication base stations.
1 Definition and structure
Aluminum substrate is a metalbased copperclad laminate with aluminum as the substrate which is mainly used for heat dissipation and circuit connection of electronic equipment Its typical structure is divided into three layers
Circuit layer A printed circuit formed by etching copper foil which is used for component assembly and connection and has better current carrying capacity than traditional FR4 board
Insulation layer The core part which has bonding insulation and thermal conductivity functions The lower the thermal resistance the better the heat dissipation performance
Metal base layer Mostly aluminum plates such as 6061 5052 etc copper or stainless steel can also be used to meet higher thermal conductivity or mechanical performance requirements
2 Core features
Excellent heat dissipation The thermal conductivity is usually 20 WmK which can quickly remove heat from the device and reduce the operating temperature
High mechanical strength More impactresistant than ceramic substrates suitable for high vibration environments
Lightweight and convenient processing Aluminum material has low density and is easy to cut drill and process
Compatible with SMT process suitable for surface mounting technology simplifying the production process
3 Main application areas
LED lighting such as street lights fluorescent lamps etc using its heat dissipation advantages to extend the life of LEDs
Power supply equipment heat dissipation of highpower devices such as switching power supplies and converters
Automotive electronics parts such as car lights and ECUs that require high temperature resistance and stability
Communication and industrial equipment base station amplifiers motor drivers etc
