Material: Aluminum Bases
Layer/Thickness: 2L/1.6 mm
Copper Thickness:1 OZ
Surface treatment:ENIG
Min Line Width: 0.13mm
Min Line Space: 0.12mm
Min Hole:0.32mm
Solder Mask:White
Technical featuer: special materials
Application Field: High frequency amplifier
Layer NO# 1 or 2Layers
Material: Aluminum 0.80~3.80W/m.k
Finished Thickness: 1mm or 1.6mm
Outer Copper: 1 ~3 OZ
Surface treatment: HASL LF / OSP / ENIG
Product type 2 Layer Metal Base PCB
Material Copper base
Layers/thickness : 2L/1.6mm
Line Space/width : 25/30mil
Surface treatment : ENIG
Minimum hole dia. 2.5mm
Outer Layer Copper Thickness 1/1 OZ
Material: Aluminum Bases
Layer/Thickness: 2L/1.6 mm
Copper Thickness:1 OZ
Surface treatment:ENIG
Solder Mask:White
Technical featuer: special materials
Minimum line spacing:0.4mm
Minimum line width: 0.3mm
Copper thickness: 18/25/35/70um
Plate thickness: 0.0075"(0.2mm)-0.125"(3.2mm)
Material: Copper substrate board
Outsourcing size: 41*25*23mm
Layers3 36 Layers
HDI Step 3+N+3
Min.Line Width0.05mm (2 mil)
Min.Line Space0.05mm (2 mil)
Min.Annular ring0.1mm (4 mil)
Min. Via0.1mm (4 mil)
Max.Size500mm X 800mm
MaterialFR4,High Tg220
Material thickness Start at 25um Plus copper
Copper thickness0.3 OZ to 10 OZ (10um 350um)
Please contact us for more information about HDI PCB Board.
10layers HDI PCB
Base material: FR4, Tg170
Surface finishing: immersion gold
Board thickness: 1.0mm
Copper thickness: 0.5oz
Minimum line width: 0.1mm
Minimum line spacing: 0.1mm
Laser drilling + blind and buried drilling Impedance control
Board stack up: 1+8+1
Impedance control
Layer count: 10 layer
Board thickness 0.80mm
Raw material FR4 370HR
Min.line width/space 0.075/0.075mm
Minimum hole diameter 0.10mm
Surface finishing ENIG
Plug via-in-pad by resin and plate flat
Product type: Aluminum Substrate
Material: Aluminum plate +high thermal insulation material
Layer/Thickness: 2L/1.6 mm
Outer Copper:/ 1.5 OZ
Surface treatment: HASL LF
Min Line Width: 0.3mm
Min Line Space: 0.3mm
Min Hole: 0.35 mm
Solder Mask: White X 2 sides
Silkscreen: Blackx 1 side
Technical featuer: special materials
Application: Lamps and lanterns
Copper Base PCB, Metal PCB is the thermal conductivity dielectric material in the MCPCB. This acts as a thermal bridge between the IC components and the metal backing plate.
Heat is conducted from the package through the metal core to an additional heat sink. On the FR4 board the heat remains stagnant if not transferred by a topical heatsink.
LED PCB always be produced with Aluminum core, but sometimes steel core PCB and copper core PCB also be used.
Copper Base PCB Metal PCB
ENIG White 1 Layer,
Copper base material.
Finished board thickness is 1.6mm.
White solder mask
1 Oz finished copper thickness.
Surface Finish is ENIG 2u
Hitech Circuits Co., Ltd. is a leading Ceramic PCB Manufacturer and Ceramic Substrate Manufacturer in China, we specialized in Ceramic PCB Manufacturer Ceramic Substrate Manufacturer, Electronic Ceramic Supplier, AL2O3 Ceramic Supplier, ZRO2 Ceramic Supplier, High Temperature Ceramic Coating, Industrial Ceramics Manufacturer, Anti ESD Coating, Anti Glue Coating, and Silicon Carbide Coating Services. The products are widely used in high power LED ceramic substrate, microwave wireless communications, HCPV solar animal cells, ceramic sensor substrates, semiconductor and military electronics.
DBC Ceramic PCB
DPC Ceramic PCB
HTCC Ceramic PCB
LTCC Ceramic PCB
MEGTRON 6 is advanced material designed for high-speed network equipment, mainframes, IC testers and high frequency measuring instruments. The main attributes of MEGTRON 6 are: low dielectric constant and dielectric dissipation factors, low transmission loss and high heat resistance; Td = 410C (77°F).
MEGTRON 6 meets IPC specification 4101 /102 /91.
Layers: 2Rigid + 2flex + 2Rigid design
Material: FR4 middle TG + Dupont AP8515R
Thickness: Rigid 0.80mm Flex 0.20mm with stiffener
Surface treatment: immersion gold
Apply for surveillance producation
Solder mask: Green + Coverlay
Legend: White
Rigid-flex Printed circuit board manufacturer from China
IPC Releases 5 New Standards for Flexible/Rigid-Flexible Printed Boards and Performance of Rigid Printed Boards
IPC announces the release of five newly revised standards covering several areas of the supply chain.
IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness PCB Assemblies
IPC-2223E, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
IPC-2591-Version 1.1, Connected Factory Exchange (CFX)
IPC-1791A, Trusted Electronic Designer, Fabricator and Assembler Requirements
IPC- 6012E, Qualification and Performance Specification for Rigid Printed Boards
PURCHASE NOW
Details on some of the changes for the newly released standards:
IPC/WHMA-A-620D provides several changes that were requested by the industry. The task group addressed the target conditions in the document by moving some conditions to acceptable criteria while other cases were moved to training.
There are several new or revised graphics
The solderless wrap section was completely revised
A new section was added for over-molding of flexible flat ribbon
IPC-2223E establishes the specific requirements for the design of flexible and rigid-flexible printed board applications and its forms of component mounting and interconnecting structures.
Several figures are updated
New sections and comments on microvia stacking
Back-drilled holes and dual row zero insertion force (ZIF) connectors updated
IPC-6012E establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards.
Provides new acceptance criteria for back drilled holes
Establishes new requirements for copper wrap plating of holes in new designs
Discusses reliability issues for microvia structures in class 3 products
IPC-2591 V1.1 establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing.
provides changes made to message sections, and message structure sections
Appendix A was added with a short description of all changes from V1.0
Appendix B provides acronyms and abbreviations
IPC-1791A provides minimum requirements, policies and procedures for printed board design, fabrication and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products.
New Appendix D covering requirements for trust certification of non-U.S. electronic design, fabrication and assembly organizations
Several sections have been updated from Scope through and including 3.0requirements
Classifications of Class I, 2 and 3 have been added
FR4 material, 0.2mm thickness pcb, thin pcb, ENIG pcb, 94v0 pcb
material: FR4,
copper finished: 1/1 OZ
finished thickness: 0.2mm
surface finished: immersion gold (Au 2Uâ??)
min hole: 0.25mm
solder mask: green
Type: Double sides printed wiring board
Laminate: FR4 TG170
Board size and thickness: 100*36*1.60mm*3UP
Surface finished: ENIG
Copper thickness: 35um
Solder mask : Green
Silkscreen : White
Material: FR-4 Tg135
PCB Size:158.75*118.6mm
Board thickness: 1.6mm
Surface finished: HAL LF
Copper thickness: 1/1 Oz
Min through hole: 0.2mm
Consumer Electronics
Material: FR-4 Tg135
PCB Size:158.75*118.6mm
Board thickness: 1.6mm
Surface finished: HAL LF
Copper thickness: 1/1 Oz
Min through hole: 0.2mm
Consumer Electronics
Material: FR-4 Tg135
PCB Size:158.75*118.6mm
Board thickness: 1.6mm
Surface finished: HAL LF
Copper thickness: 1/1 Oz
Min through hole: 0.2mm
Consumer Electronics
Thermoelectric Separation Copper Based PCB
Layers: 1
Thickness: 3mm
Cu PCB for high power LED light
Substrate material: Red Copper
Copper thickness: 1 Oz
Plating process: Immersion gold
Description: Power LED MCPCB
Countersink holes
