Layers:1-50 layers
Material:FR4 standard Tg 130C, FR4 medium Tg 150C, FR4 high Tg 170C
Board Thickness:.0079"-.126"(0.2mm-8.0mm)
Copper Thickness:0.5oz-12oz(18um-210um)
Inner layer Copper Thickness:0.5oz-6oz(18um-70um)
Board size:1200x700mm
Min Tracing/Spacing:3.0mil/3.0mil
Min Annular Ring:3mil
Min drilling Hole diameter:0.2mm(8mil), 0.1mm(4mil)-laser drill
Solder Mask:Green, Green matt, Black, Black Matt, White, Red, Yellow, Blue
Silkscreen color:
White, Blue, Black, Red, Yellow,no
Surface finish:
HASL -Hot Air Solder Leveling
Lead Free HASL - RoHS
ENIG -Electroless Nickle/Immersion Gold - RoHS(Thick of Au 1-4 u")
Immersion Silver - RoHS
Immersion Tin - RoHS
OSP -Organic Solderability Preservatives - RoHS
Surface/Hole plating thickness:20-30um
Board thickness tolerance:0.1mm ~ 10%
Board size tolerance:0.1mm~0.3mm
PTH hole size tolerance:.003"(0.08mm)~.006"(0.15mm)
NPTH hole size tolerance:.002"(0.05mm)
Copper thickness tolerance:+0um+20um
Impedance tolerance:5%~10%
SMD Pitch:0.2mm(8mil)
BGA Pitch:0.2mm(8mil)
Aspect Ratio(hole size: board thickness):1:40
Chamfer of Gold Fingers:20, 30, 45, 60
