POM plastic possesses the same priority features as other plastic polymers, some of the highlights of the special resin:
High hardness
Bearing good
Low friction number
High resistance to abrasion
High temperature resistant
Less water intake
Has anti-static ability
Dimensional stability, little change
Less smoke burns when burning
High glossy surface
High crystallization
In addition to the priority points, POM plastic also has some limited formats such as:
Quality acid resistance and alkali
High hatch rate when changing secretions
Operation mode Heat range
MATERIAL: POM regrind black color full container available
CATEGORY: POM
TYPE: Regrind
GRADE: Black color
SPECIFICATION: 1 full container available
Origin: Tunisia
LOADING WEIGHT: 23 Ton
FOB (USD/Ton): 650$ - 850$
Packaging: Jumbo Bag
Est. Shipping Time: 15, 30, 45 days
About Us
Endoscopic Resources specializes in sourcing excellent new and pre-owned medical equipment. We are a qualified repair center and guarantee the equipment we sell.
Please contact us if you have any questions, comments, or concerns. We will respond within 1 business day and do our best to help you out! We want to be sure you are completely satisfied with your purchase.
Automatic series for customized Spider hand delta robot for Parallel robot-3c industry,
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Other standard automation systems : Automatic bagging, automatic sorting, automatic packing, automatic palletizing, automatic palletizing and automatic loading ... any want to automaitc same this kind ,offer training after-sale service ! whole life maintenance!
The UV laser marking machine is developed by using a 355nm UV laser. This machine uses a third-order intracavity frequency doubling technology. Compared with infrared lasers, the 355nm UV laser has a very small spot, and the marking effect is directly interrupted by a short-wavelength laser. The molecular chain greatly reduces the mechanical deformation of the material. Thermal deformation (cold light), because it is mainly used for ultra-fine marking and engraving. It is especially suitable for applications such as marking, micro-hole drilling of food and pharmaceutical packaging materials, high-speed dicing of glass materials, and complex pattern cutting of silicon wafers.