Vin Solutions

Dongguan Kam Er Te Electronics Co., Ltd. Was established in 2005, focusing on one-stop production and manufacturing services for electronic products such as SMT surface mount processing/PCBA processing/DIP plug-in post welding/functional testing/finished product assembly, PCBA OEM materials/OEM materials/component procurement.

We just processed in a large batch of chipsets. I posted below current inventory and attached pictures of each type of chipset. Please review and let me know your interest/offer.

Chipset 1 (H61) â?? 3,350 units
Chipset 2 (H81) â?? 2,206 units
Chipset 3 (H55) â?? 436 units
Chipset 4 (B250) â?? 1,600 units
Chipset 5 (SR406) â?? 345 units


Thank you,

Divanti Group

Item Details:

Layers: 1~32

Board thickness : 0.1mm-7.0mm

Material :FR- Rogers

Max panel size : 32(800mm1200mm)

Min hole size: 0.075mm

Min line width : 3mil(0.075mm)

Surface finish: OSP

Copper thickness: 0.5-7.0OZ

Soldermask: Green/Yellow/Black/White/Red/Blue

Silkscreen : Red/Yellow/Black/White

Min PAD: 5mil(0.13mm)

Inter package: Vacuum

Outer package: Carton

Outline tolerance: 0.75mm

Hole tolerance: PTH 0.025

Certificate : UL IATF16949

Special request: Blind hole+Gold finger + BGA

Material Suppilers: Shengyi, KB, Nanya, ITEQ,etc.


Electronics Circuit board PCB Assembly

1. RoHS & Lead Free
2. UL & ISO certified
3. Quality & service
4. Quick turn
5. Surface finish: Immersion Gold/HALS/OSP/Gold finger/Carbon print/Peelable mask/Plating gold
6. Solder mask colour: green/white/yellow/blue/red/black
7. Silk screen: white/black/yellow/red/blue/green
8. Applied in industrial facilities/medical facilities/consumer electronics/telecommunications/power supply
We deliver services, not only products.
We offer solutions, not only goods.



Deliver Time For PCB & PCBA

1. PCB production time: sample: 3-4 days / production: within 7 days

2. Fast pcb delivery: 24 hours for 2L ; 48 hours for 4L ; 72 hours for 6L.

3. Component purchase: 2 days if all components is available in our domestic market.

4. PCB Assembly: samples: within 8 days / mass production: within 12 days


LAYER PROTOTYPE

MASS PRODUCTION (above 20 m2)


One-stop Service Include:

PCB Prototype

Quick Turn PCB

Single-Sided PCB

Double-Sided PCB

Multilayer PCB

Rigid PCB

Flexible PCB

Rigid-Flex PCB

LED PCB

Aluminum PCB

Metal Core PCB

Thick Copper PCB

HDI PCB

BGA PCB

High TG PCB

PCB Stencil

Impedance Control PCB

PCB Assembly

High-Frequency PCB

Bluetooth Circuit Board

Automotive PCB

USB Circuit Board

Halogen-Free PCB

Antenna PCB

we are leading manufacturer & exporter of standoff/spacers as per requirement or Drawing

INDIUM PHOSPHIDE (InP) WAFERS are semiconductor materials made of indium phosphide, a compound semiconductor that is widely used in high-frequency and optoelectronic applications. Due to its efficient electron mobility and direct bandgap properties, InP is favored for devices such as:

High-speed electronics
Laser diodes
Photodetectors
Telecommunications applications, including optical fiber communication
We offer the following InP Wafers:
Undoped InP Wafers: These are pure InP with no intentional doping, used in various applications where intrinsic properties are required.
N-type InP Wafers: Doped with donor impurities (such as tellurium) to increase electron concentration, useful in transistors and high-speed electronics.
P-type InP Wafers: Doped with acceptor impurities (such as zinc) to create holes in the semiconductor, used in light-emitting devices and other optoelectronics.
InP Substrates: Used as a base for growing other semiconductor materials in heterostructures for various applications.
InP Membrane Wafers: Thin layers of InP used for specific applications, including applications in flexible electronics and advanced photonic devices.
InP-based Quantum Dot Wafers: Engineered to create quantum dots that can be used in photonic and optoelectronic devices for enhanced performance.