Copper clad laminate (CCL) is a kind of plate-shaped material, which is made of electronic glass fiber cloth or other reinforced materials dipped with resin, one or two sides covered with copper foil and hot pressed.
Since started in 2002, our company has been adhering for the products quality and researching. We have been recognized of all the certification as needed(CQC UL ISO9001 etc.)Our products have been selling well as they are environmentally friendly.
All sheets
Mixed single-side and double-side
Mixed FR4 CEM1 CEM3
(18/18+35/0+35/35+70/0)
And we are not sure the percentage
we have 5-9.9cm 10-14.9cm 15-19.9cm 20up 1/4+1/6 half and we mainly sell 5-9.9cm and 10-14.9cm others need to wait more time
1. High Temperature & High Frequency Resistant Circuit Base Material
1) Polyimide woven glass fibre copper clad laminate
Performance: Excellent high-frequency dielectric properties, High temperature & radiation resistant. Long used under 230¡æ high temperature.
Usage: It is broadly used in the environment which request long life usage under the high temperature. For example, high temperature & high frequency resistant circuit boards in many electric equipments of Airplane engine instrument, Pit Drilling, Auto-control equipment and MULLER.
Copper foil thickness£º0.018¡«0.105mm
2) Polyimide woven glass fibre insulation laminated board
Performance: Excellent high-frequency dielectric properties, High temperature & radiation resistant. Long used under 230¡æ high temperature.
Usage: It is broadly used in making special high temperature & high frequency resistant insulation board such as Dry type transformer, Special Motor and Radio & TV Transmitter.
2. Microwave Circuit Base Material
1) PTFE woven glass fibre copper clad laminate
Performance: Little breakage and Steady dielectric constant. This product has a good electrical properties and high machining performance.
Usage: It is widely used in Moving Communication, Radar, Microwave antenna and all kinds of Communication Equipments in microwave circuit.
Performance: Little breakage and Steady dielectric constant.
High temperature resistant is ¡Ý150¡æ. This product has a high machining performance. The Machining technics of the printed circuit board is the same as the traditional FR-4.
Usage: It is widely used in Satellite communication, Solid-state phased-array radar, Microwave antenna and all kinds of Communication Equipments in microwave circuit.
Performance: Little breakage and Steady dielectric constant.
Usage: It is used in making Si-B-O-N material.
Specification: 625¡Á1040mm
Thickness£º0.1-60mm
3. Ultra Thick Copper Clad Laminate
Performance: Best electrical properties. It can be afford high power electric current. The peel strength of the copper foil can be arrived over 3N/mm.
Usage: It is used in making electricity, automobile electronic products and high power electronic equipment circuit base material.
Specification: 510¡Á610 mm; 625¡Á1000mm; 1040¡Á1250mm
Copper Clad Laminate Thickness: 0.15¡ª5.0mm;
Insulation Laminated Board Thickness£º0.10--60mm.
4. Metal Base Copper Clad Laminate
1) Copper base copper clad laminate
2) Aluminum base copper clad laminate
3) Iron base copper clad laminate
Polyphenylene ether resins (PPO) are widely used in the manufacture of copper-clad laminates (CCL) and printed circuit boards (PCB), mainly due to their excellent insulating properties, heat resistance and mechanical strength. PPO resins not only improve the dielectric and mechanical properties of CCLs, but also enhance their dimensional stability and low water absorption.
Application of Polyphenylene Ether Resin in Copper Clad Laminate and Its Advantages
The application of polyphenylene ether resin in copper-clad laminates is mainly reflected in its excellent performance:
Insulation performance: Polyphenylene ether resin has low dielectric constant and dielectric loss, which can effectively reduce the interference and loss in signal transmission.
Mechanical properties: the modified PPE resin can significantly improve the mechanical strength and dimensional stability of copper-clad laminates, ensuring stable performance in high-frequency applications.
Thermal performance: Polyphenylene ether resins can maintain stable performance at high temperatures, which is suitable for high-frequency copper-clad laminates.
FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with copper foil on one side or both sides, and CCL is finally formed by hot pressing and curing.
FR-4 copper clad laminated sheet has excellent thermal stability and machinability, widely used in the manufacture of printed circuit board (PCB) for television sets, computers, communications equipment and other electronic products.
