Type Multi crystalline silicon wafer ( B grade)
Size(mm) 156.6 (+0.0 to -0.5).
P/N type P
Do pant Boron
Resistivity(ohmcm) 0.5 û 5.0
Carbon Content 5.0x1017 atoms per cm3
Oxygen Content 3.0x1017 atoms per cm3
Life Time > 1.5 microsecond.
T T V less than or equal 50 microm.
Thickness 200 microm(+/- 30 microm)
Production(Casting) method EMC
Diffusion length greater than or equal to 50 micrometer
Conner angle(degree) 90.0 +/- 0.3
Beveled edge width 0.5 - 2 mm
Appearance Chip ( Width 0.8 mm, less than or equal 4 points.
Advantage of
High efficiency P Type Polycrystalline Solar Wafer
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
Type : P type
Resistance:1~3s
minority carrier:>2 s
Hem width:157.00~157.25mm
Thickness:200±20m
Transfer efficiency:>18.8%
Technology : Diamond wire cutting
Type : P type
Resistance:1~3μs
minority carrier:>2 μs
Hem width:157.00~157.25mm
Thickness:200±20μm
Transfer efficiency:>18.8%
Advantage of
P Type Polycrystalline Solar Wafer
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
http://en.hengxingchinese.com/
Hengxing company website: https://hengxingsteelwire.com/
Email contact US:wmsale@hxkjgf.com
Technology : Diamond wire cutting
Type : P type
Resistance:1~3μs
minority carrier:>2 μs
Hem width:157.00~157.25mm
Thickness:200±20μm
Transfer efficiency:>18.8%
Advantage of
P Type Polycrystalline Solar Wafer
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
http://en.hengxingchinese.com/
Hengxing company website: https://hengxingsteelwire.com/
Email contact US:wmsale@hxkjgf.com
Advantage of
P Type Polycrystalline Solar Wafer
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Hengxing company website: https://hengxingsteelwire.com/
Email contact US:wmsale@hxkjgf.com
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
Type : P type
Resistance:1~3
minority carrier:>2
Hem width:157.00~157.25mm
Thickness:200±20μm
Transfer efficiency:>18.8%
Technology : Diamond wire cutting
Type : P type
Resistance:1~3s
minority carrier:>2 s
Hem width:157.00~157.25mm
Thickness:200±20m
Transfer efficiency:>18.8%
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Advantage of
Sawing Wire for Solar Wafer Cutiing
Very thin and tensile wires of low keff loss
Hence more wafters per cut and less fractures
Make higher productivity
Tight diameter and ovality tolerances
A wide range of spool types
An advanced winding technology
Sawing wire , also called ultra fine wire,is cold drawing high strengh brass plated steel wire with high carbon.
It can be used for cutting high hardness of single crystal line silicon,poly crystal line silicon,quartz material,etc.
(1)Sawing wire is a high grade steel wire that can be used to cut a wide range of products.It serves as the abrasive carrier in a Multi Wire Saw.
(2)The technique finds its origin in the world of solar cells. From the mid eighties, this technology was developed to decrease kerf loss and increase productivity.
(3)In the early nineties the method was introduced for slicing silicon ingots to wafers for the electronics industry. Since then the technique has been more and more introduced for cutting other hard and brittle materials as well.
(4)Saw wire is used to cut a wide variety of products, such as silicon, germanium, gallium aresenide, quartz, indium phosphide, to name only a few.
( 5 )Saw wire is mostly used in the production of solar cells. The use of photovoltaic energy is increasing, as humanity becomes more and more aware of the scarcity of the natural resources.
Hengxing company website: https://hengxingsteelwire.com/
Email contact US:wmsale@hxkjgf.com
