Supplier : Industrial processing laser systems, especially specialized in products like diode pump laser marking systems, LPY laser welding systems and CO2 laser marking, cutting systems
Established: 2001
Standards: ISO9001,CE
Verification Status
Contact Details:
2 Bldg Changyuan New Material Harbor
Keyuan N. Road
Shenzhen
518057
Guangdong
China
The UV laser marking machine is developed by using a 355nm UV laser. This machine uses a third-order intracavity frequency doubling technology. Compared with infrared lasers, the 355nm UV laser has a very small spot, and the marking effect is directly interrupted by a short-wavelength laser. The molecular chain greatly reduces the mechanical deformation of the material. Thermal deformation (cold light), because it is mainly used for ultra-fine marking and engraving. It is especially suitable for applications such as marking, micro-hole drilling of food and pharmaceutical packaging materials, high-speed dicing of glass materials, and complex pattern cutting of silicon wafers.
1. Lightweight,energy-saving and maintenance-free Integrated air-cooled structure. Volume only 0.15m�³.
2. 6 preset cleaning processes+ 3 custom ones Corresponding to different usage requirements. Simple operation.
3. Double-wobble Cleaning Head Scanning width up to 190mm.
4. 8 Light Modes Meet various operation requirements.
5. High Power Density and Strong Output.Energy is twice that of ordinary models, effectively addresses issues of difficult cleaning and inefficiency.
Fiber laser with 20 w power
Marking area : 100 x 100 mm ; 200 x 200 mm
Longer laser source life
No consumables cost
Lower electrical consumption
Lower maintenance cost
Compact & user friendly
