HDD-A12Pro Desktop POS System Machine 12.5'' Full HD 1080P Printer Cash Register Pos Swipe Machine Product Name HDD-A12 Pro Material Plastic and Iron Function POS System, Cash Register Package Standard Export Carton Size: L 41cm* W 19cm* H 39cm Weight: 2.8 kg. Interface consists of USB, Serial, HDMI, LAN, SD Card and can be connected to cash drawer. Built-in 58 mm thermal printer with 2D barcode scanner.
1GB, 8GB EMMC
7 inch Capacitive Touch Screen Display
80mm built-in Thermal & Lablel Printer
Dual SIM Cards, Support Micro TF Card
Including NFC and IC card (optional)
Charging Dock Stand
Black, White and Red Colors
Can be used as Standalone Cash Register
Built-in 80mm Thermal and Label printer make it unique from others. Possess low power consumption.
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Packaging & Delivery
Selling Units:
Single item
Single package size:
31X23X10 cm
Single gross weight:
1.510 kg
Package Type:
Standard export carton
Ready to Ship
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Product Name
HDD-80260
Material
Plastic
Function
Thermal Receipt Printer
Package
Standard Export CartonSize: L 17cm* W 13cm* H 12cm Weight: 1.825kg
Interface consists of USB, Serial, HDMI, LAN, SD Card and can be connected to cash drawer. Built-in 58 mm thermal printer with 2D barcode scanner.
Packaging Details
Standard export carton
Ready to Ship
Port
Shanghai Guangzhou
Lead Time:
Quantity(Pieces) 1 - 10 11 - 100 >100
Est. Time(days) 7 20 To be negotiated
The UV laser marking machine is developed by using a 355nm UV laser. This machine uses a third-order intracavity frequency doubling technology. Compared with infrared lasers, the 355nm UV laser has a very small spot, and the marking effect is directly interrupted by a short-wavelength laser. The molecular chain greatly reduces the mechanical deformation of the material. Thermal deformation (cold light), because it is mainly used for ultra-fine marking and engraving. It is especially suitable for applications such as marking, micro-hole drilling of food and pharmaceutical packaging materials, high-speed dicing of glass materials, and complex pattern cutting of silicon wafers.
