hot air rework desoldering station is a professional phone repair rework station, desoldering and soldering of BGA IC components, 1000W 500 C QUICK 861DW lead free rework station for mobile phone BGA desoldering repair.
Hot Air Rework Station Lead Free Soldering Station For BGA IC Components Welding.
220V or 110V option voltage. Note: 110V, need customized, time: about 1-2 days.
With 3pcs Heat Gun Nozzles - size : 5mm 6mm 8mm, if need 3mm 12mm nozzle, need bought it alone. More QUICK 861DW Nozzles
Features :
With CH1, CH2, CH3 three working channels, and each channel can be set to the amount of wind, and temperature.
Password protection and key lock function.
Facilitate real-time operation, with magnetic switch control lever is placed in the handle holder immediately into hibernation.
With automatic sleep function, in a dormant state parameters can be set.
Sensor closed loop, microcomputer zero trigger temperature control, power, heating quickly, easily and precisely adjust the temperature stable, free from the influence of wind.
The use of brushless vortex blower, air flow adjustable, wide range, can be adapted to a variety of uses.
The system has an automatic cooling function of wind capacity, extend the life of the heating element and protect the hot air handle.
Specification :
Power: 1000W
Voltage: AC 220V 110V
Temperature range: 100 C 500 C
Air volume ratio range: 1 to 120
Maximum air flow: 120L min
Dimensions: 188 (L) 245 (D) 135 (H) mm
Package List :
1pcs x Quick 861DW rework station
1pcs x Hot air gun
1pcs x Hot air gun holder
3pcs x Heat gun nozzles
1pcs x Ground lead
1pcs x Instructions
Feature:
1.3 independent heating system
ZM-R6200 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking period, you can use software to choose freely or use top heater or bottom heater depart, and combine freely with top and bottom heatercapacity, to make it easies for rework double BGA, CCGA, QFN, CSP, LGA, SMD etc. External sensor socket is precise detected temperature to analyze and proof on actual temperature curve of BGA at the same time.
2.Precise optical alignment system
with optical alignment system and clear images, components can enlarge up to Maximum 230 times, mounting accuracy within +/-0.01mm, with a beam split, zoom in, zoom out and micro-adjust functions, adopted 12HD monitor.
3.Multi-function operation system
With touch screen interface, k-type thermocouple, close-loop control, and intelligent temperature compensation with automatically system, integrated design of top heater and sucker point. It can auto identify a high degree of suction and mounting. With automatic soldering and desoldering function. the temperature can be set to 6 segment and 6 segment constant temperature control, N groups of storage temperature setting parameters according to kinds of BGA chip set.
4.Superior safety functions
After finish desoldering and soldering, there is alarming, when temperature goes out of control, the circuit will automatically power off, it is of double excess temperature protection function. Temperature parameter has a password to avoid arbitrary changes, with superior safe protection functions, can protect PCB, components and the machine from damage at any abnormal situation
Specification parameters
1 Total power 5100W Max
2 Top heater power 1200W 1st heater¡
3 Bottom heater power 1200W 2nd heater
4 3rd IR heater 2700W (independent controlling left and right IR heaters)
5 power AC 220V;¨¤10 50/60Hz
6 Electrical materials temperature control system Adopted Dalian University of Technology
7 Dimensions 640¢630900mm
8 Temperature control K-type thermocouple (Closed Loop),
9 Positioning V type groove;with universal fixture
9 P C B size Max 410 370mm¡; Min65 65mm
10 Available BGA chip 11- 80 80mm
11 External temperature sensor 1piece
12 Net weight 65kg
Package Wooden box
Dimension :80*80*105cm
Gross weight: 120kg
Delivery time: 3-7 working days
1.Embedded industrial control computer,windows system. Adopt high definition human-machine interface, PLC control, there is password protection and modify function, can show 4-6 temperature curves and store multiple sets of data, with instant curves analysis function, and analyzing and correct BGA temperature at any time;
2.For guarantee the heating effect and mounting precision, control independently the top heater and mounting heat ,adopted linear slide make X,Y,Z axis can do micro adjustment and rapid positioning;after mounted, no need to move the PCB board in the bottom area, it can heat directly when move the top heater, avoid the moving of bga placement when move the PCB. Ensured the mounting accuracy and welding effect.
3.top and bottom heaters are hot-air heating, the third IR heater is infrared heating, the top and bottom heaters can heat PCB from upper and bottom at the same time, three heaters control independently. Show the heat time, temperature, and curves act, on the touch screen.
4.choose high accurate K type close-loop thermocouple, and PID parameters automatic adjustment system control temperature precisely through PLC and temperature module, keep the temperature deviation at 2 degree.external temperature measuring interface check temperature precisely, achieve accurate analysis and collate the actual temperature curve.
5.V-groove PCB support, with rapid, convenient and accurate positioning, can fit for all kinds of PCB board.
6.Flexible and removable universal fixture the operator and the protective effects and no damage to the PCB board suitable for all kinds of sizes of BGA repair.
7.Adopted all kinds of BGA nozzles, with 360,227; rotation, easy for installation and replacement, customized is available;
8.Adopt adjustable CCD color optical system, with a beam split, zoom in, zoom out and micro-adjust functions, has automatic chromatism resolution and brightness adjustment system, can adjust the clearness of the image by hand or automatic.
9.The X, Y axis and R angle with micrometer adjust; alignment accuracy is within0.01mm, with high definition HD monitor, avoiding human operation errors completely.
10.There are 8 segments rising temperature and 8 constant temperatures, can store millions of temperature curves, curve analyze, set and modify on the touch screen.
11.With voice control ãalarm in advance .À function, 5-10 seconds before finished soldering and desoldering alarm the operators with voice control to prepare the related works. Powerful cross-flow fan cool the PCB board fast by hand or automatic after desoldering and soldering, it can prevent the PCB board from deformation, ensure the welding effect.
12.With vacuum pump,|¦Ìangle 60 rotation, micrometer precise adjust mounting and nozzle, need no air source.
13.With CE certification, there is emergency stop switch and automatic cut off protective device when abnormal situation happen.
Specifications and technical parameters:
1 Total Power-4850W
2 Top heater-800W
3 Bottom heate-The second heat area 1200w, the third heat area 2700w (plus size area to suit any kinds of PCB board)
4 Power-AC220V 50/60Hz
5 Dimensions-L790W640H800 mm
6 Positioning-V-groove, PCB support can X,Y axis adjust at any direction, additional with universal fixture
7 Temperature control-K Sensor, Closed loop
8 Temperature accuracy-2 degree
9 PCB size-Max 370 x 410mm Min 22 x 22mm
10 Work bench fine-tuning-front and back 15mm, right and left 15mm
11 Camera magnification10x-100x times
12 BGA chip2*2-80*80mm
13 Minimum chip spacing-0.15mm
14 External Temperature Sensor1-5 pieces available to choose, optional
15 Placement Accuracy-0.01MM
16 Net weight-93kg
Package Wooden box
Dimension :80*80*105cm
Gross weight: 120kg
Delivery time: 3-7 working days
Feature:
1.3 independent heating system
ZM-R6200 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking period, you can use software to choose freely or use top heater or bottom heater depart, and combine freely with top and bottom heatercapacity, to make it easies for rework double BGA, CCGA, QFN, CSP, LGA, SMD etc. External sensor socket is precise detected temperature to analyze and proof on actual temperature curve of BGA at the same time.
2.Precise optical alignment system
with optical alignment system and clear images, components can enlarge up to Maximum 230 times, mounting accuracy within +/-0.01mm, with a beam split, zoom in, zoom out and micro-adjust functions, adopted 12 HD monitor.
3.Multi-function operation system
With touch screen interface, k-type thermocouple, close-loop control, and intelligent temperature compensation with automatically system, integrated design of top heater and sucker point. It can auto identify a high degree of suction and mounting. With automatic soldering and desoldering function. the temperature can be set to 6 segment and 6 segment constant temperature control, N groups of storage temperature setting parameters according to kinds of BGA chip set.
4.Superior safety functions
After finish desoldering and soldering, there is alarming, when temperature goes out of control, the circuit will automatically power off, it is of double excess temperature protection function. Temperature parameter has a password to avoid arbitrary changes, with superior safe protection functions, can protect PCB, components and the machine from damage at any abnormal situation
Specification parameters
1 Total power- 5100W Max
2 Top heater power- 1200W ¡ê¡§1st heater
3 Bottom heater power -1200W ¡ê¡§2nd heater
4 3rd IR heater- 2700W (independent controlling left and right IR heaters)
5 power-AC 220V10- 50/60Hz
6 Electrical materials temperature control system Adopted Dalian University of Technology
7 Dimensions- 640,630,900mm
8 Temperature control K-type thermocouple (Closed Loop),
9 Positioning V type groove;with universal fixture
9 P C B size- Max 410 mm Min65mm
10 Available BGA chip-180mm
11 External temperature sensor1piece
12 Net weight- 65kg
Package Wooden box
Dimension :80*80*105cm
Gross weight: 120kg
Delivery time: 3-7 working days
WDS-700 BGA Rework Station are widely used to replace and repair the BGA chip in laptop, mobile phone, The main user is repairing shops and factory to provide the after-sales service and rework.
How to separate BGA chip from motherboard / How to replace a new BGA chip
Repair steps
1.Separate the BGA chip from mother board -we called desoldering
2.Clean Pad
3.Reballing or replace a new BGA chip directly
4.lignment/Positioning -Depend on experience ,silk frame ,optical camera
5.replace a new BGA chip - we called Soldering
Features
1 Suitable for LED lamp beads repairing, size of micro LED components not less than 0.6*0.6mm can be repaired
2 Suitable for LED lamp beads of tape packaging and bulk materials, also any BGA and components which are difficult to repair.
3 High solution optical alignment system, accurate LED components positioning, ensure precise mounting.
4 Optical alignment is controlled electrically, can rotate automatically
5 Mounting head built-in pressure testing device, to protect the PCB
6 Built-in infrared laser positioning, fast positioning for PCB.
7 Adopt HIWIN precision guide rail for up and down movement system, ensure reliable and accurate running
8 Adopt up and down alignment for top and bottom heater, heating for appointed local zone, prevent PCB to turn yellow.
9 Bottom heater up and down manually, can adjust the heating height real time.
10 Adopt ceramics infrared radiator for IR heater, heating stably and uniformly with long serve life
11 Human-machine interface has multiple operation mode and permission, welding, and mounting manually, easy operation.
12 High resolution touch screen, which is up to 800*600 pixel
13 Adopt joystick control for alignment system, no need setting complicated parameters
14 Adopt Delta double ball bearing flow fan for air supply¡ê;no need external air source
15 Adopt DCCE 6 channel module for temperature control system, automatic PID adjustment
16 Monitoring heaters real time, when accident happens, relevant sensors will send signal to PLC,which will close output channel and display fault condition. Protect itself automatically.
Specifications
Total Power Max 5300W
Power AC 220V10% 50/60 Hz
Top heater power 1200W
Bottom heater power 1200W
IR power 2700W
Hot air temp. 400 230; (Max)
Preheating temp. 400
Positioning V-groove +laser positioning + universal fixture
PCB size Max 410 370 mm
Preheaing size 370mm 270mm
Chip type BGA,QGN,CSP,POP,QFN, Micro SMD,LED lamp beads
Chip size Max 80¨80mm Min 22 mm
Dimensions L640 W630 H900 mm
Temperature sensor 1 piece
Net weight 70kg
Package Wooden box
Dimension :80*80*105cm
Gross weight: 120kg
Delivery time: 3-7 working days
Features
1 Suitable for LED lamp beads repairing, size of micro LED components not less than 0.6*0.6mm can be repaired
2 Suitable for LED lamp beads of tape packaging and bulk materials, also any BGA and components which are difficult to repair.
3 High solution optical alignment system, accurate LED components positioning, ensure precise mounting.
4 Optical alignment is controlled electrically, can rotate automatically
5 Mounting head built-in pressure testing device, to protect the PCB
6 Built-in infrared laser positioning, fast positioning for PCB.
7 Adopt HIWIN precision guide rail for up and down movement system, ensure reliable and accurate running
8 Adopt up and down alignment for top and bottom heater, heating for appointed local zone, prevent PCB to turn yellow.
9 Bottom heater up and down manually, can adjust the heating height real time.
10 Adopt ceramics infrared radiator for IR heater, heating stably and uniformly with long serve life
11 Human-machine interface has multiple operation mode and permission, welding, and mounting manually, easy operation.
12 High resolution touch screen, which is up to 800*600 pixel
13 Adopt joystick control for alignment system, no need setting complicated parameters
14 Adopt Delta double ball bearing flow fan for air supply no need external air source
15 Adopt DCCE 6 channel module for temperature control system, automatic PID adjustment
16 Monitoring heaters real time, when accident happens, relevant sensors will send signal to PLC,which will close output channel and display fault condition. Protect itself automatically.
Specifications
Total Power Max 5300W
Power AC 220V10% 50/60 Hz
Top heater power 1200W
Bottom heater power 1200W
IR power 2700W
Hot air temp. 400(Max)
Preheating temp. 400Max
Positioning V-groove +laser positioning + universal fixture
PCB size Max 410 ,370 mm
Preheaing size 370mm,270mm
Chip type BGA,QGN,CSP,POP,QFN, Micro SMD,LED lamp beads
Chip size Max 80,80mm Min 22 mm
Dimensions L640 W630 ,H900 mm
Temperature sensor 1 piece
Net weight 70kg
Package Wooden box
Dimension :80*80*105cm
Gross weight: 120kg
Delivery time: 3-7 working days
WDS-750 higher automatic bga rework station
https://youtu.be/5fbCW4nN3w4
Features of WDS-750
1.touch screen interface,heating time,heating temp,temp rise speed,cooling time,alarm advance,vacuum time are set up inside the touch screen,easy to use;
2.Panasonic PLC, independent control temperature control module,shows 3 temp curves all the time,4 independent sensors,check the temp accurately for the chip points,ensure the weld yield.
3.3 independent heating zones,each heating zone can set up the heating temp,heating time,temp rise rate;Six period of heating temperature, simulate the reflow heating mode,set up as Preheating, keeping, heating, welding, welding, cooling;
4.auto feed chip,auto pick up chip,auto belowing chip,can identify the central position automatically when optical alignment;
5.multifunction mode choice, four modes as weld,remove,mount,manual,automatic and semi-auto function,meet the various needs of the users;
6.Uses the high precision K-type thermocouple closed-loop control which is imported from USA,with the unique heating method,ensure the weld temp precision control within ±1 â??
7.Uses imported optical alignment system,500 pixel HD camera,HDMMI HD signal output,15 inch HD LCD,high accurate micrometer X/Y/Z axis adjustment,ensure the location precision within 0.01-0.02mm;
8.The upper heating head and placement head are designed 2 in 1,different size of heating nozzles are provided,easy to remove and install,can be customized,meet the more requirement for users.
9.High automation and precision to avoid artificial error fully,can make the best repairing effect for the lead free technology,double-deck BGA,QFN,QFP,capacitance resistance and other components and parts.
10.Equipped the extra camera to obverse the solder ball melting,to ensure the temp curve and weld effect(this function is optional).
WDS-750 parameter
Total power:6800W
Upper heating power:1200W
Bottom heating power:1200W
Bottom IR heating power:4200W2400W is controlled
Power supply:(Single Phase) AC 220V±10 50Hz
Location way :Optical camera+ V-shape card slot + laser position for fast location
Temperature control:High precision K sensor closed loop control,independent temperature control with ±1 â?? precision
Appliance selection:High sensitive touch screen + temperature control mode +Panasonic PLC +step driver
Max. PCB size:500Ã?450mm
Min. PCB size:10Ã?10mm
Sensor:4units
Chip amplification multiple:2-30X
PCB thickness:0.5-8mm
Chip size :0.3*0.6mm-8cm
Min. chip space:0.15mm
Max. mount loading:500G
Mount precision:±0.01mm
Overall size :L670Ã?W780Ã?H850mm
Optical camera:Can be removed front and back,left and right,prevent the dead angle
Machine weight :90kg
SUGON 858D Hot Air Gun Soldering Station 700W Temperature 500 Digital Display SMD Desoldering Station BGA Rework Station.
Product Introduce:
1. Essential basic soldering tool,fast heat up,easy to desoldering.
2. Skeleton winding Heating Element,higher heat generating efficiency,more stable longer use life.
3. Long service life brushess fan,safety&efficiency,auto start-stop technology
120L/min large volume.
4. F temperature display options,meet different country need
5. Temperature Calibration,when the display temp different from test temp,can use this function.
6. Not need large space 858D also can work perfect.
Product Data:
1. Input voltage: 110V,220V~240V.
2. Output Power: 700W.
3. Temperature range: 100~500 Celsius.
4. Temperature Stabillty: Good
5. Display mode: LED Display
6. Airflow type: Brushless-Motor Fan
ATTEN ST862D Intelligent digital display rework station For PCB chip soldering repair, 1000W Whirlwind ATTEN ST-862D lead-free hot air gun soldering station, ATTEN ST-862D Hot Air Rework Station 1000W Whirlwind 20L-120L/Min.
Feature:
1. The LCD screen displays the operating temperature and status to achieve visual and human-machine interaction.
2. Menu-style operation, three sets of fast temperature / air volume access keys to achieve common temperature fast switching, 100 C -480 C.
3. Strong airflow with brushless fans.
4. Plug-in heating chip replacement is fast.
5. Straight wind and spiral wind convertible.
6. Automatic sleep.
7. Temperature lock function, timed work function.
8. Software calibration temperature control function, temperature compensation, to achieve constant temperature work.
Input Voltage : 220V / 110V.
Power: 1000W.
Temperature Range: 100~480
Maximum Air Flow:120L/min.
