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Sending Inquiry For: 3.2Mm, 20L Blind&buried Vias Board

Jun-29-16
 
layer count:20L
base material: FR-4 TG170

copper thickness: all layers 2OZ
board thickness: 3.2mm±0.3mm

min hole diameter: 0.50mm(19mil)
min trace width: 0.20mm(8mil)
min trace spacing: 0.20mm(8mil)
suface finishing: ENIG
test: flying probe

panel dimension: 106.63mmX134.42 mm
panel method: 6up, 2*3
blind:dr1-2,dr3-4, 2 step blind vias
via diameter: 0.5mm(19mil)
lead time:fastest 10wds,normal 15-20 wds
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