Layer count: 4-20layers
Type of stack up: 1+n+1, 2+n+2
Material available: fr4, high tg fr4, halogen free fr4
Board thickness: 0.4-3.2mm
Finished copper thickness: 1/3oz ¡§c 3oz
Min trace width/spacing: 3/3mil
Min through hole: 0.2mm
Min blind via: 0.1mm
Surface treatment: immersion gold, enig + osp
Vacuum package
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