Base material: ceramics, aluminum, rogers, high tg, f4b, f4bk, f4bt, tp, pf, fr4, fr1, fr2, cem-1, cem-3, etc.
Board thickness: 0.30 to 3.20mm (12 to 26mil)
Copper thickness: 0.50 to 5 ounce
Solder mask: lpi solder mask, conventional solder mask, peelable solder mask, uv solder mask
Minimum line width: 0.1mm (4mil)
Minimum line space: 0.1mm (4mil)
Minimum hole diameter: 0.25mm (10mil)
Pth hole diameter tolerance: +/-0.076mm (+/-3mil)
Npth hole diameter tolerance: +/-0.03mm (+/-1.2mil)
Maximum board size: 460 x 620mm (18 x 24)
Board finishing type: hot air leveling, soft gold, hard gold, immersion gold, gold fingers.











Carton packing.