Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
Type : P type
Resistance:1~3
minority carrier:>2
Hem width:157.00~157.25mm
Thickness:200±20 m
Transfer efficiency:>18.8%
Advantage of
top quality factory price 156x156mm 200um high quality Hot Sales A Grade polysilicon wafer
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Advantage of
156x156mm 200um High efficiency silicon wafers
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
Type : P type
Resistance:1~3
minority carrier:>2
Hem width:157.00~157.25mm
Thickness:200±20μm
Transfer efficiency:>18.8%
Advantage of
top quality factory price 156x156mm 200um high quality Hot Sales A Grade polysilicon wafer Manufacturer
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
Type : P type
Resistance:1~3s
minority carrier:>2 s
Hem width:157.00~157.25mm
Thickness:200±20m
Transfer efficiency:>18.8%
Advantage of
156x156mm 200um High efficiency silicon wafers
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
Type : P type
Resistance:1~3s
minority carrier:>2 s
Hem width:157.00~157.25mm
Thickness:200±20m
Transfer efficiency:>18.8%
top quality factory price 156x156mm 200um high quality High efficiency solar silicon wafers
Manufacturer
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
Type : P type
Resistance:1~3s
minority carrier:>2 s
Hem width:157.00~157.25mm
Thickness:200±20m
Transfer efficiency:>18.8%
Advantage of
High efficiency P Type solar silicon wafers
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
There are 12 sets of WuXi ShangJi brand diamond wire slicing machines, 8 sets reforming machines, the single blade capacity is 20,000 pieces per day, and the annual production capacity is over 10 million pieces.
Advantage of
Hot Sales A Grade solar silicon wafers
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
There are 12 sets of WuXi ShangJi brand diamond wire slicing machines, 8 sets reforming machines, the single blade capacity is 20,000 pieces per day, and the annual production capacity is over 10 million pieces.
Advantage of
Hot Sales A Grade polysilicon wafer
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
Type : P type
Resistance:1~3s
minority carrier:>2 s
Hem width:157.00~157.25mm
Thickness:200±20m
Transfer efficiency:>18.8%
http://en.hengxingchinese.com/
Hengxing company website: https://hengxingsteelwire.com/
Email contact US:wmsale@hxkjgf.com
Technology : Diamond wire cutting
Type : P type
Resistance:1~3μs
minority carrier:>2 μs
Hem width:157.00~157.25mm
Thickness:200±20μm
Transfer efficiency:>18.8%
Hengxing science and techology co.,ltd built in 1995, with 24 years of steel wire transforming and coating industries, our main product as galavanized steel wire, strand, PC steel wire strand, steel cord radial tire, hyrolic hose and polycrystaline silicon. Listed on Shenzhen A stock market in 2007,we have independent R&D center, passed the ISO, SGS,BV certification and so on. As the biggest galavanized steel wire and srand manufacture in China, and the biggest steel cord for radial tire, with high quality and performance, our product widely used in the industries as electric cable, suspension construction, radial tire and hydrolic hose, and sawing.
Advantage of
P Type Polycrystalline Solar Wafer Manufacturer
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Technology : Diamond wire cutting
Type : P type
Resistance:1~3 s
minority carrier:>2 s
Hem width:157.00~157.25mm
Thickness:200±20m
Transfer efficiency:>18.8%
Technology : Diamond wire cutting
Type : P type
Resistance:1~3s
minority carrier:>2 s
Hem width:157.00~157.25mm
Thickness:200±20m
Transfer efficiency:>18.8%
Advantage of
high quality Hot Sales A Grade polysilicon wafer
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Advantage of
high quality P Type Polycrystalline Solar Wafer
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Technology : Diamond wire cutting
Type : P type
Resistance:1~3 s
minority carrier:>2 s
Hem width:157.00~157.25mm
Thickness:200±20 m
Transfer efficiency:>18.8%
Advantage of
High efficiency P Type polysilicon wafer
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Technology : Diamond wire cutting
Type : P type
Resistance:1~3s
minority carrier:>2 s
Hem width:157.00~157.25mm
Thickness:200±20m
Transfer efficiency:>18.8%
Advantage of
Hot Sales A Grade polysilicon wafer
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Technology : Diamond wire cutting
Type : P type
Resistance:1~3s
minority carrier:>2 s
Hem width:157.00~157.25mm
Thickness:200±20m
Transfer efficiency:>18.8%
CVD Diamond has been recognized an ideal material for various applications because of its outstanding properties which includes extreme hardness and strength, high thermal conductivity, low thermal expansion, excellent dielectric properties, resistance to chemical attack, and optical transmission over a wide spectral range. It can be widely used in complex tooling and machining processes, thermal-management applications, semiconductor industry and microwave engineering.
Microwave-Transparent Windows and Optics
We supply high-quality diamond optical products that are transparent in the microwave region with a wide range of size and thickness. With our cutting-edge laser technologies, we can customize the optical windows in any shape and dimension according to clients requirement.
Specifications:
Diameter of 65mm (F150mm on request)
Double side surface roughness: Ra 10nm
Flatness: 4um/cm
With higher transparency
Thickness less than 0.5mm
Can be laser cut to any size and shapes
