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Features:
CW-F04 is a machine cutting multi-panel PCB according to the pre-edited path by use of high-speed motion of milling cutter. Getting rid of the cutting flaws of manual cutting, C-CUT or Push cut, it improves product quality and reduces scrap rates.
The machine adopts human-machine interface vie Windows XP, which is simple and convenient, able to achieve automatic cutting path correction, edit and modification of high-pixel CCD program, block program and single-step program.
The PCB with two interactive plates loading and unloading materials will effectively reduce machine idle time, thus achieve an ideal productivity. With a high-pixel CCD amplification lens, auxiliary demonstration program and editing function, the machine can work more accurately and get sharper graphics. Equipped with automatically mark positioning correction system, the motion path is displayed in real time and traced in an analog way; all in all realize a clear vision.
Due to the automatic position correction function, PCB can c ut more accurately. Within the maximum 3mm, the machine can correct the deviated position automatically, therefore lowers the standard for operators to place the plate, in this way to improve work efficiency immensely.
The copy function of the two plates, the block, arrays, multi-angle plate, the single tracing modification function and block editing function indeed simplify the process of programming and increase efficiency.

Features:
1.Neat and smooth edge, no burr or overflow
2.More quick and easy, shorten the delivery time;
3. High quality ,no distortion,surface clean& uniformity;
4. Gathering the CNC tech,laser tech,software techâ?¦High accuracy,High speed



Description:
PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in break age. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.
Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.



Cutting Application:
FPC and some relative materials;
FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting;