The breaking strength of diamond wire is high and stable; the diamond particles is well distributed and and no agglomeration, to keep the diameter of diamond wire uniform withdifferent diamond density; strongbonding force of plating ,and there's no peeling and cracks; the coating is compact and smooth, the appearance looks silver andbeautiful.
Item: Diamond wire
Shape:wire
Material: Imported C-steel
Diameter:55μm-450μm available
24 years of history in steel wire transforming and coating
Listed on Shenzhen A stock market in 2007
An annual output of 3000000 Kilometers of sawing wire
ISO/TS 16949 And ISO9002 certificated
Silica, silicon carbide, silicon carbide, also known as carbon refractory sand, is made of quartz sand and petroleum coke, sawdust and other raw materials in smelting in electric resistance furnace, high temperature and be become.Green silicon carbide black silicon carbide and silicon carbide two commonly used basic varieties: (1) black silicon carbide containing SiC by about 95%, its toughness is higher than the green silicon carbide, mostly used for processing low tensile strength of material, such as glass, ceramics, stone, refractory material, cast iron and nonferrous metal, etc.;(2) the green silicon carbide containing SiC98 % above, good self-sharpening, mostly used for processing hard alloy, titanium alloy and optical glass, also used for honing cylinder jacket and fine grinding HSS cutting tools.
Green silicon carbide is produced as the same type as the black silicon carbide, except the different raw materials.Ití»s crystallization have higher purity and hardness.Green silicon carbide is suitable for processing hard alloy, metallic and non-metallic marterails with hard and brittle feature such as copper, brass, aluminium, magnesslum , jewel, optical glass, ceramics, etc.Super micropower of it is also a kind of ceramics material.
Advantage of
156x156mm 200um High efficiency P Type polysilicon wafer Manufacturer
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
Type : P type
Resistance:1~3μs
minority carrier:>2 μs
Hem width:157.00~157.25mm
Thickness:200±20μm
Transfer efficiency:>18.8%
Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
Type : P type
Resistance:1~3μs
minority carrier:>2 μs
Hem width:157.00~157.25mm
Thickness:200±20μm
Transfer efficiency:>18.8%
Advantage of
Hot Sales A Grade polysilicon wafer
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Hengxing company website: https://hengxingsteelwire.com/
Email contact US:wmsale@hxkjgf.com
1850 Silicon Plates Suppliers
Short on time? Let Silicon Plates sellers contact you.
Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
Type : P type
Resistance:1~3μs
minority carrier:>2 μs
Hem width:157.00~157.25mm
Thickness:200±20μm
Transfer efficiency:>18.8%
Advantage of
high quality High efficiency P Type polysilicon wafer
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Hengxing company website: https://hengxingsteelwire.com/
Email contact US:wmsale@hxkjgf.com
Advantage of
156x156mm 200um High efficiency silicon wafers
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
Type : P type
Resistance:1~3
minority carrier:>2
Hem width:157.00~157.25mm
Thickness:200±20μm
Transfer efficiency:>18.8%
top quality factory price 156x156mm 200um high quality High efficiency solar silicon wafers
Manufacturer
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
Type : P type
Resistance:1~3s
minority carrier:>2 s
Hem width:157.00~157.25mm
Thickness:200±20m
Transfer efficiency:>18.8%
Advantage of
156x156mm 200um High efficiency silicon wafers
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
Type : P type
Resistance:1~3s
minority carrier:>2 s
Hem width:157.00~157.25mm
Thickness:200±20m
Transfer efficiency:>18.8%
Advantage of
High efficiency P Type solar silicon wafers
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
There are 12 sets of WuXi ShangJi brand diamond wire slicing machines, 8 sets reforming machines, the single blade capacity is 20,000 pieces per day, and the annual production capacity is over 10 million pieces.
Advantage of
Hot Sales A Grade solar silicon wafers
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
There are 12 sets of WuXi ShangJi brand diamond wire slicing machines, 8 sets reforming machines, the single blade capacity is 20,000 pieces per day, and the annual production capacity is over 10 million pieces.
Advantage of
top quality factory price 156x156mm 200um high quality Hot Sales A Grade polysilicon wafer
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Technology : Diamond wire cutting
Type : P type
Resistance:1~3μs
minority carrier:>2 μs
Hem width:157.00~157.25mm
Thickness:200±20μm
Transfer efficiency:>18.8%
Advantage of top quality factory price 156x156mm 200um high quality Hot Sales A Grade polysilicon wafer ?The production process is simple, cost-effective, and reduces silicon waste ?High conversion efficiency, low fragmentation rate and low optical attenuation ?Manufacturing Specialization, Intelligence and Greening ?Customized products to meet customer
Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
Type : P type
Resistance:1~3
minority carrier:>2
Hem width:157.00~157.25mm
Thickness:200±20 m
Transfer efficiency:>18.8%
Advantage of
top quality factory price 156x156mm 200um high quality Hot Sales A Grade polysilicon wafer
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Advantage of
top quality factory price 156x156mm 200um high quality Hot Sales A Grade polysilicon wafer Manufacturer
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
Type : P type
Resistance:1~3s
minority carrier:>2 s
Hem width:157.00~157.25mm
Thickness:200±20m
Transfer efficiency:>18.8%
Advantage of
Hot Sales A Grade polysilicon wafer
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
Type : P type
Resistance:1~3s
minority carrier:>2 s
Hem width:157.00~157.25mm
Thickness:200±20m
Transfer efficiency:>18.8%
http://en.hengxingchinese.com/
Hengxing company website: https://hengxingsteelwire.com/
Email contact US:wmsale@hxkjgf.com
Technology : Diamond wire cutting
Type : P type
Resistance:1~3μs
minority carrier:>2 μs
Hem width:157.00~157.25mm
Thickness:200±20μm
Transfer efficiency:>18.8%
Hengxing science and techology co.,ltd built in 1995, with 24 years of steel wire transforming and coating industries, our main product as galavanized steel wire, strand, PC steel wire strand, steel cord radial tire, hyrolic hose and polycrystaline silicon. Listed on Shenzhen A stock market in 2007,we have independent R&D center, passed the ISO, SGS,BV certification and so on. As the biggest galavanized steel wire and srand manufacture in China, and the biggest steel cord for radial tire, with high quality and performance, our product widely used in the industries as electric cable, suspension construction, radial tire and hydrolic hose, and sawing.
1850 Silicon Plates Suppliers
Short on time? Let Silicon Plates sellers contact you.
