Sg01L-5Lens Sic Based Uv Photodiode

Properties of the SG01D-5LENS UV photodiode
Broadband UVA+UVB+UVC, PTB reported high chip stability, for very weak radiation
Radiation sensitive area A = 11.0 mm2
TO5 hermetically sealed metal housing with concentrator lens, 1 isolated pin and 1 case pin
10uW/cm2 peak radiation results a current of approx. 350 nA

GaAs Wafers
Gallium Arsenide (GaAs) wafers are critical components in modern electronics and photonics due to their superior electrical and optical properties.

Here�¢??s a focused overview:

GaAs�¢?? is shorthand for Gallium Arsenide, a compound made up of two elements, and the semiconductor used to manufacture GaAs wafers. GaAs is used as a direct bandgap semiconductor, which in layman�¢??s terms, simply means that particles such as electrons can pass through components much quicker and with very little interference. This makes them particularly useful in optical devices because photons, the basic unit for all light, can pass through lenses with ease.

What are GaAs Wafers Use For?

The use of GaAs wafers is dictated by the capabilities of the compound. Because GaAs is a direct bandgap semiconductor, it is especially useful in sensitive electronic equipment that requires amplifying low frequencies. Some of the most common applications for GaAs wafers include:

Radars

Radio communication equipment

Tachometers

Satellites

Microwave

LEDs

SG01M-B5
UVB-only SiC based UV photodiode A = 0.20 mm2

Properties of the SG01M-B5 UV Photodiode
* UVB-only sensitivity, PTB reported high chip stability
* Active Area A = 0.20 mm2
* TO5 hermetically sealed metal housing, 1 isolated pin and 1 case pin
* 10mW/cm2 peak radiation results a current of approx. 2500 nA

SG01M-B5 UV Photodiode Specifications
Typical Responsivity at Peak Wavelength: 0.125/AW
Wavelength of max. Spectral Responsivity: 280nm
Responsivity Range: 231 to 309nm
Active Area: 0.20mm2
Dark Current (1V reverse bias): 0.7fA
Capacitance: 50pF
Short Circuit (10mW/cm2 at peak): 2500nA
Temperature Coefficient: < 0.1%/K
Operating Temperature: -55 ~ +170'C
Storage Temperature: -55 ~ +170'C
Soldering Temperature (3s): 260'C
Reverse Voltage: 20V

SG01S-C18
UVC-only SiC based UV photodiode A = 0.06 mm2

Properties of the SG01S-C18 UV Photodiode
* UVC-only sensitivity, compliant with DVGW W294, PTB reported high chip stability
* Active Area A = 0.06 mm2
* TO18 hermetically sealed metal housing, 1 isolated pin and 1 case pin
* 10mW/cm2 peak radiation results a current of approx. 720 nA

SG01S-C18 UV Photodiode Specifications
* Typical Responsivity at Peak Wavelength: 0,120/AW
* Wavelength of max. Spectral Responsivity: 275nm
* Responsivity Range: 225 - 287nm
* Active Area: 0.06mm2
* Dark Current (1V reverse bias): 0.2fA
* Capacitance: 15pF
* Short Circuit (10mW/cm2 at peak): 720nA
* Temperature Coefficient: < 0.1%/K
* Operating Temperature: -55 ~ +170°C
* Storage Temperature: -55 ~ +170°C
* Soldering Temperature (3s): 260°C

Floating cable which can be applied to underwater robot equipment, either in fresh water environment or in seawater environment. It is widely used in marine exploration robot, underwater ROV UAV remote control submersible, underwater camera, underwater construction, underwater search and rescue robot, pipeline detection robot, submersible pump and the link between various underwater electrical equipment and shore based equipment; Link of signal transmission, power supply and equipment control system from underwater to water.

The 6-axis F/T Sensor KIT, featuring AIDIN ROBOTICS' advanced force-sensing technology, is now optimized for Rainbow Robotics & Neuromeka cobot series. It overcomes the limitations of capacitance measurement and offers functions like force control and collision detection. This kit improves manufacturing efficiency and ensures safe human-robot collaboration.

The 6-axis F/T Sensor KIT, featuring AIDIN ROBOTICS' advanced force-sensing technology, is now optimized for Rainbow Robotics & Neuromeka cobot series. It overcomes the limitations of capacitance measurement and offers functions like force control and collision detection. This kit improves manufacturing efficiency and ensures safe human-robot collaboration.

Electrical Characteristics
- Rated Voltage : 0.6/1 kV AC
- Rated DC Voltage : 1.5 kV
- Maximum Permitted DC Voltage : 1.8 kV (conductor/conductor,
non earthen system, circuit not under load)
- Maximum Permitted AC Voltage : 1 KV
- Working Voltage : DC 1000 V
- Spark Test : 6000 V. ac (8400 Vdc)
- Voltage Withstand : 6500 V as per EN50395 for 5 min
- Ampacity : According to requirements for cables for PV systems

Technical Data
- Ambient Temperature : -40C +90C
- Minimum Bending Radius : 5 x OD (fixed), 15 x OD
(occasional flexing)
- Flame retardant according to IEC 60332-1-2
- Low smoke emission < 20% as per ASTM D-2843
- Halogen free according to EN 50267-2-1/-2, IEC 60754-2
- Maximum Temperature at Conductor : 120C (20000h)
- Short Circuit Temperature : 200�?�°C (at conductor max. 5sec)
- Thermal Endurance Test : According to EN 60216-2
(temperature index +120C)
- High Temperature Pressure : Test according to EN 60811-3-1
- Excellent mechanical and electrical properties.
- UV resistance & OZONE resistance
- Flexibility & suitability for fast & easy installation

Cable Standard
EN 50618

Standard Packing
Coils 100, 200,300, 500, 1000m

Conductor
Flexible Electrolytic fine Tinned
copper class-5 conductor according
to IEC 60228

Insulation
XLPO (Crosslinked Halogen Free &
Flame Retardant)

Sheath
XLPO (Crosslinked Halogen Free &
Flame Retardant)

Color
Red, Black and also available black color with red lining.

Application
For Solar Panel, Solar Power Plant,
Solar Pump Installation.

The skid-mate is an air dampened cushioning device that provides a fast, cost effectiveand durable customized solution to protect sensitive products from shock and vibration. Theskid-mate can be easily mounted on a crate or pallet base creating an air-ride cushion in placeof hardwood skid runners eliminating the need for expensive air-ride trucks.Each color coded skid-mate corresponds to a specific load range and allows users to calculatetheir requirements simply and easily to avoid potential laboratory testing and use of expensivepackaging materials.

Reduce packaging design & assembly time and cost• eliminate costly damage from handling hazards during shipment• reduce costs associated with shock and vibration damage