Die Board Laser Cutting Machine

Quick Details

Application: Laser Cutting Condition: New Laser Type: CO2 Applicable Material: Plywood, Wood Cutting Thickness: 0-20mm Cutting Area: 2000-3000mm Cutting Speed: 0.3-0.5m/min CNC or Not: Yes Cooling Mode: Water Cooling Control Software: CNC Graphic Format Supported: DXF, PLT Place of Origin: Hubei, China (Mainland) Brand Name: SENMAO Model Number: SMCY-3000 Certification: Patent Technology After-sales Service Provided: Engineers available to service machinery overseas Name: Cylindrical Die Board Laser Cutting Machine Laser power: 150W*2 Customized: Per client`s demand color: silvery
Packaging & Delivery

Packaging Details: Wooden Case
3 packages
No.1: GW: 1110kgs
NW: 960kgs
Meas: 3.67m X 1.14m X 2.10n
No.2: GW: 980kgs
NW: 850kgs
Meas: 3.55m X 1.14m X 1.58m
No.3: GW: 70kgs
NW: 50kgs
Meas: 0.68m X 0.57m X 0.89m
Manufacture Cylindrical Die Board Laser Cutting Machine price


Introduction


1. One of series of cylindrical die board cutting machine
2. Adopting technology patented of two laser heads die cutting up and down at the same time
3. Being the new generation of laser die cutting machine and unparalled in the die cutting field
4. Ball screw driving with CNC system and special designed software guarantee the high precision and stability
5. High efficient and energy
6. Very low power consumption with only compressed air used and easy maintenance
7. Smoke extraction system making the working condition free of smoke pollution
8. Equipped with laser chiller
Specification


Model
SMCY-3000
Application
Cylindrrical die board cutting
Laser type
CO2
Laser power
150W*2
Catalogue
Laser equipment
Driving system
Servo motor
Cutting diameter
180-540mm
Cutting length
3000mm
Cutting precision
0.05mm
Cutting width
0.35-0.71mm
Cutting speed
0.36-0.6m/min
Total power
3kw
Patented No.
ZL200320115463.X
Applicable materials
Wood and plywood

Feature


1.Patented
2.2 laser heads cutting up & down same time
3.Cylindrical board

Advatage


* To meet the requirements in knife molding, printing and packaging
* lower risk and cost and fast return of investment
* Possibility to achieve efficient laser die cutting process
* High efficiency and energy
* Easy to edit core technical operations with low maintenance cost
* Easier laser processing of cylindrical die board
* Resolving all problems of kerfs of board surface and bottom are not vertical & slitting width is inconsistent and oblique slit phenomenon save the production cost of cylindrical die boards
* Production processing even don not need additional gas of waiting for the machine boot when turn it on

Characteristic of machine:
1. Quality accredited by CE, ISO9001
2. Double laser heads, cut bidirectionally from top and bottom at the same time, with high cutting efficiency, also assure the cutting seam to be straight
3. Automatic tracing system for focus point, overcomes the barrier of surface uneven
4. Powerful software, like autocad, coreldraw, and adobe photoshop for unique designing.
5. Adopting imported guide rails, ballscrew transmission system, servo motor and our special designed software, insure steady performance
6. Cnc operation, with high cutting speed and accuracy
7. Exhaust system to keep the working condition free of smoke pollution
8. Can cut max. 25mm thickness plywood
9. With our multi-function bending machine, can realize the full automatic process of template making.

Technical parameters:
Model of machine Hld1208 Hld 1210 Hld 1212 Hld 1215 Hld 1218 Hld 1220
Valid size (mm) 1200*8001200*10001200*12001200*15001200*18001200*2000
Laser tube type Co2 sealed laser tube
Laser power 300w (work bidirectionally with two laser heads)
Cutting speed 0-200mm/s
Power supply 220v 10a
Cutting width0.3-3mm(optional)
Max. Thickness25mm
Color separationYes
Cutting precision 0.02mm
Image form PLT, EPS, BMP, DXF
Control system:Movement control board/CNC
Transmission Ballscrew
Driving systemServo motor
Air feed meansAir.


Wood case.

Technical specifications:.
Model HL-YLC500-2010
Cutting zone2000*1000mm
Cutting thickness0.2-6mm
Laser routeFixed laser route, work piece moving by cross slide working table
Transmission methodServo ballscrew
Cutting positioningRed light pointer
Operating systemWindows 2000/xp
Max output power500w
Laser wavelength1064nm
Pulse frequency1-300hz
Min.Linewidth0.15mm
Electrical source380v/50hz/100a
X/y/z axis geometric positioning accuracy 0.08mm/1000mm

X/y/z axis re-orientation accuracy 0.04mm
Control systemOffline motion control
Cooling system5p water cooling
Max cutting speed35mm/s
Weight1500kg.


Wood case.

Technical parameters
(the working area and laser power can be customized according to requirement)
Model of machine CX-CO2-30/60/80/100(optional)
Laser tube Co2 laser tube
Cutting area110mm 110mm /300mm 300mm(optional)
Laser power 30w/60w/80w /100w(optional)
Marking speed0-7000mm/s
Operating voltage Ac220v 10%, 50hz
Location precision 0.01mm
Working environmentTemperature humidity 0-95%
Min. Line width0.015mm
Min. Character0.3mm
Graphic format supportedBmp, HPGL(PLT), JPEG, GIF, TIFF, PCX, TAG, CDR, DWG, DXF, COMPATIBLE HPG ORDER, SUPPORT DXF, PLT, BMP and dxt(tiandao embroider software), etc.
Marking depth 0.01-0.2mm
Working tableLift platform up to 1, 000mm from the bottom to the top
Auxiliary devic eExhaust fan and cooling system
Laser wavelength1064nm.


Wooden case

Technical parameters
(the working area and laser power can be customized according to requirement)
Model of machine HLM-SD-50
Laser tubeSemi-conductor mould
Cutting area110mm 110mm /300mm 300mm(optional)
Laser power 50w
Marking speed0-7000mm/s
Operating voltage Ac220 10%, 50hz
Location precision 0.003mm
Working environmentTemperature: 0-40 centidegree, humidity: 45%-85%
Marking depth 0-0.3mm
Min. Line width 0.02mm
Min. Character 0.2mm

Graphic format supported BMP, HPGL(PLT), JPEG, GIF, TIFF, PCX, TAG, CDR, DWG, DXF, compatible hpg order, support DXF, PLT, BMP and dxt(tiandao embroider software), etc.
Working tableLift platform up to 1, 000mm from the bottom to the top
Auxiliary deviceExhaust fan and cooling system
Laser wavelength1064nm.


Wood case

Technical parameters
Model HL-W-200
Working table dimension200mm x 100mm(customized)
Welding depth0. 1-2mm
Max output power 200w
Laser wavelength 1064nm
Pulse width 0.3-20ms
Welding frequency 1-100hz
Pump sourceXenon lamp
Single pulse engrgy 105j
Consumed power 18kw
Electrical source 220v 10%/50hz/40a
Adjustable facula size0.2-2mm
Waveform number 16
Power consumed 6kw
Cooling mode Water-cooling
Control of worktable Manual+CNC programming (optional)
Consumable material Krypton lamp / filter / water / electricity
Optional accessories Anti-laser glasses
Usage environmentClean, no shaking, temperature 13 humidity 5% -75%.


Wood case.

The UV laser marking machine is developed by using a 355nm UV laser. This machine uses a third-order intracavity frequency doubling technology. Compared with infrared lasers, the 355nm UV laser has a very small spot, and the marking effect is directly interrupted by a short-wavelength laser. The molecular chain greatly reduces the mechanical deformation of the material. Thermal deformation (cold light), because it is mainly used for ultra-fine marking and engraving. It is especially suitable for applications such as marking, micro-hole drilling of food and pharmaceutical packaging materials, high-speed dicing of glass materials, and complex pattern cutting of silicon wafers.

Pulse 200W JPT Laser Cleaning Machine for Rust Removal Oil Paint Removal

1. Lightweight,energy-saving and maintenance-free Integrated air-cooled structure. Volume only 0.15m�³.
2. 6 preset cleaning processes+ 3 custom ones Corresponding to different usage requirements. Simple operation.
3. Double-wobble Cleaning Head Scanning width up to 190mm.
4. 8 Light Modes Meet various operation requirements.
5. High Power Density and Strong Output.Energy is twice that of ordinary models, effectively addresses issues of difficult cleaning and inefficiency.