Notes:
- The packaging price is quoted based on¡êoSize 0.2m287;FR-4 Tg135 material; 1.0-1.6mm thickness; H-1oz copper; PTH161;Y0.3mm; 5/5mil; LF HASL; IPC class II;
- Does not cover the freight cost and international bank transferring cost.
The packaging price is quoted based on¡êoSize 0.2m287;FR-4 Tg135 material; 1.0-1.6mm
thickness; H-1oz copper; PTH161;Y0.3mm; 5/5mil; LF HASL; IPC class II
4-layer printed circuit board with selective hard gold coating 50 micro inch (1.25 micrometers)
Pcb p / n: 842378
1. Number of layers: 4 layers
2. Material: fr4
Thickness 3.Board: 1.6mm
4. Copper thickness: 1/1/1/1 ounce of copper
5. The minimum drill size: 0.2 mm
6. Minimum track and clearance: 0.125 mm
7. Surface: submerged gold + selective solid gold
8.Green soldering mask
9.Special technology: selective solid gold coating up to 50u "(1.25um)
10.Applications: consumer electronic products
11.One stopping the turnkey service of ems, including the purchase of materials, smt and through assembly, assembly of prefabricated boxes
12.Ul is recognized and complies with rohs requirements.
Place of Origin: Liaoning, China (Mainland) Brand Name: GESP Model Number: 2 Layer Pcb Base Material: FR-4 Copper Thickness: 0.25 Oz -12 Oz Board Thickness: 1.6mm-3.2mm 0.2mm-4.5mm Min. Hole Size: 0.15mm Min. Line Width: 5mil Min. Line Spacing: 4 mil Surface Finishing: HASL/enig/OSP/immersion silver /gold finger Base Material:: FR-4,CEM-3, Roger,teflon , taconic,arlon , Metal/ceramic/aluminum base Copper Thickness:: 0.25 oz -12 oz Board Thickness:: 0.005 Certificate:: ISO/UL/RoHS/TS16949 Gold thickness:: 0.05UM V-cut Scoring:: YES Standards:: IPC Class 2, Class 3 Max. Panel Size:: 22 Impedance Control: yes Surface Finishing:: HASL Lead Free/OSP/Soft Gold/Hard Gold
Number of layer: 1-40L(Rigid Flex 1-26L)
Base material: CEM-3, FR4, High TG FR4, Aluminum, Rogers, Arlon, etc.
Copper weight: 0.5OZ-6OZ(18mil-210mil)
Board thickness: 0.2-7.2mm(8mil-282mil)
Board types: Rigid, Flexible, Rigid-flex, Buried & Blind via board, HDI, etc.
Silk screen: White, blue, black, etc.
Solder mask: Green, black, red, blue, yellow, white, etc.
Surface finished: OSP, HASL, ENIG, ENEPIG, Silver, Gold plating, Hard gold, Immersion Tin, Immersion Gold, Carbon ink, etc.
Test: Fly Probe test, fixture test
Performance test: 100% electricity performance test
Min hole size: 0.2mm, Laser 0.1mm
Min line width/Space: 3mil/2mil
Outline profile: Rout, V-cut, Bridge, Stamp hole
Max panel size: 1000*600mm for Single and double side, 600*600mm for multi-layer
Min panel size: 10*10mm
Hole center position tolerance: ±0.05mm
