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R2R Flexible Printed Circuit Assembly

Supplier From United States
Feb-04-25

Explore high-volume flex manufacturing with our R2R SMT-Flex�® technology. We offer top-quality automated assembly for your needs. Contact us for more details.

Price and Minimum Quantity

Price: Negotiable
MOQ: Not Specified

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Inp Wafers, WAFERS

$350 - $2.50K / Piece (CIF)
MOQ: 10  Pieces
Sample Available
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INDIUM PHOSPHIDE (InP) WAFERS are semiconductor materials made of indium phosphide, a compound semiconductor that is widely used in high-frequency and optoelectronic applications. Due to its efficient electron mobility and direct bandgap properties, InP is favored for devices such as:

High-speed electronics
Laser diodes
Photodetectors
Telecommunications applications, including optical fiber communication
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Undoped InP Wafers: These are pure InP with no intentional doping, used in various applications where intrinsic properties are required.
N-type InP Wafers: Doped with donor impurities (such as tellurium) to increase electron concentration, useful in transistors and high-speed electronics.
P-type InP Wafers: Doped with acceptor impurities (such as zinc) to create holes in the semiconductor, used in light-emitting devices and other optoelectronics.
InP Substrates: Used as a base for growing other semiconductor materials in heterostructures for various applications.
InP Membrane Wafers: Thin layers of InP used for specific applications, including applications in flexible electronics and advanced photonic devices.
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4 layer board, blud soldermask, immersion gold surface finishing.



Depend on customer requirements.
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Supplier From Shenzhen, China
 
2 layers rigid-flex pcb
Minimum line width/space: 8mils
Surface finish: immersion gold
Board thickness: 0.50mm
Minimum drilled hole diameter: 8mils
Copper thickness: 0.5oz
Special process : 0.10mm flexible pcb inside


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