Electroplating Grade Copper Sulphate:
Description: High-purity grade for electroplating applications.
Applications: Electroplating, metal finishing.
Specifications:
Test Specification
Purity 99%
Copper Content 25%
pH (5% solution) 3.0-4.0
Supplier: Copper sulphate 24.5%,
manganese sulpahte 32%,
cobalt sulphate 20.5%,
ferrous sulphate 19% & 30%,
ammonium molybdate 54%,
zinc sulphate mono 33% & hepta 21%,
magnesium sulphate 9.6%,
boron 20%,
boric acid, borax decahydrate 10.5% & pentahydrate 15%,
water soluble fertilizers,
potassium schoenite,
edta chelates(zn, mg, mn, cu, ca, fe),
amino acid 80% & 50%,
amino cheleted mix, (zn, cu, ca, mn, mg, fe),
humic acid granular 80%,
potassium humate flakes 98%,
potasium fulvic humate 98%,
humic acid powder 95%,
potassium humate crystal 98%,
potassium fulvic humate 98%,
seaweed extract powder/flakes,
fulvic acid 81%,
silicon super spreader,
glycine cheleted mixture (cu, mn, cr, zn),
choline chloride 50%, 60%, 75%, 98%,
bypass fat 84% & 99%,
yeast extract powder,
beef extract powder,
peptone,
dextrose monohydrate.
