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Immersion Tin 4 Layer Fpc

Supplier From China
Dec-14-07

Key Specifications/Special Features:

Four-layer FPC
Board dimensions: 300 x 205mm
Base material: polyimide
Surface treatment: immersion tin


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Price and Minimum Quantity

Price: Negotiable
MOQ: Not Specified

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We just processed in a large batch of chipsets. I posted below current inventory and attached pictures of each type of chipset. Please review and let me know your interest/offer.

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Divanti Group
Oct-17-07
Supplier From Shenzhen, Guangzhou, China
 
Double-sided fpc with immersion tin

Number of layer:double-sided
Min hole.Diameter:0.2mm
Min line space/width : 3mil/3mil
Surface finish: immersion tin


Vacuum
GOLD Member
VERIFIED
Mar-08-25

Inp Wafers, WAFERS

$350 - $2.50K / Piece (CIF)
MOQ: 10  Pieces
Sample Available
Supplier From South Hackensack, New Jersey, United States
 
INDIUM PHOSPHIDE (InP) WAFERS are semiconductor materials made of indium phosphide, a compound semiconductor that is widely used in high-frequency and optoelectronic applications. Due to its efficient electron mobility and direct bandgap properties, InP is favored for devices such as:

High-speed electronics
Laser diodes
Photodetectors
Telecommunications applications, including optical fiber communication
We offer the following InP Wafers:
Undoped InP Wafers: These are pure InP with no intentional doping, used in various applications where intrinsic properties are required.
N-type InP Wafers: Doped with donor impurities (such as tellurium) to increase electron concentration, useful in transistors and high-speed electronics.
P-type InP Wafers: Doped with acceptor impurities (such as zinc) to create holes in the semiconductor, used in light-emitting devices and other optoelectronics.
InP Substrates: Used as a base for growing other semiconductor materials in heterostructures for various applications.
InP Membrane Wafers: Thin layers of InP used for specific applications, including applications in flexible electronics and advanced photonic devices.
InP-based Quantum Dot Wafers: Engineered to create quantum dots that can be used in photonic and optoelectronic devices for enhanced performance.
Feb-03-18
Supplier From Hangzhou, Zhejiang, China
 
4-Layer, Immersion Gold-PCB
4 Layer PCB Board, Immersion Gold PCB, Customized PCB, High Frequency Board, HDI PCB Supplier
Layer: 4L
Board thickness: 0.8mm
Suface Finish: Immersion Gold
Trace/Space: 5/6mil
Smallest Hole Diameter: 0.25MM
PCBMAIN can OEM PCB including single-side PCB, double-side PCB, immersion gold PCB, high frequency board, HDI PCB, high density multilayer PCB, multilayer PCB including 2 layer flexible PCB, 4, 6, 8, 10, 12 layer PCB board.
Feb-03-18
Supplier From Hangzhou, Zhejiang, China
 
4-Layer, Immersion Gold Gold fingers-PCB
Multilayer PCB, 4 Layer PCB Board, Multilayer FPC, Immersion Gold PCB, Gold Fingers PCB, OEM PCB Manufacturer
Layer/Board thickness: 4L/1.6mm
Suface Finish: Immersion Gold
Trace/Space: 5/5mil
Smallest Hole Diameter: 0.2MM
Golder fingers
PCBMAIN can produce multilayer hasl PCB including 2 layer flexible PCB, 6,4,8,10,12 layer PCB board, multilayer FPC, immersion gold PCB, gold fingers PCB and other high density multilayer PCB.
May-10-12
Supplier From Dongguan, Guangdong, China
 
Layer: 2 layer
Materials: PI
Copper Thickness: 35um
Min Board Thickness: 0.1mm
Surface coating: HAL, HAL LF, Immersion Gold, Immersion Tin, Immersion Silver
PI thickness: 1/2mil, 1 to 10 mil
ADH thickness: 1/2mil, 1mil
FPC, flexible PCB OEM/ODM.
Sep-24-07
Supplier From Shenzhen, Guangzhou, China
 
Double-sided fpc

Base material :fccl
Number of layer:double-sided
Min hole.Diameter:0.2mm
Min line space/width : 3mil/3mil
Surface finish: immersion tin
Quality certification: ul&iso9001
Flammability rate: 94v-0
Quality standard:ipc-6013f/aql-ii



Vacuum
Apr-25-19
Supplier From Shenzhen, Guangdong, China
 
FPC Process Capability
processing layers: 1-6 layers
Finished thickness: 3mil (0.08mm)
Minimum aperture: 4mil (0.10mm)
Min.line width / spacing: 2 mil (0.05mm)
Maximum board size: 10 "x 45" (250x 1200mm)
Surface Treatment: OSP, HASL, Electric Nickel / Gold, , Chemical nickel / gold, lead-free HASL, Immersion Gold
Insulation resistance: ± 1011 (Normal Normal)
Thermal shock resistance: 260 10 sec.
Processing materials: Polyimide (PI), polyester (PET), polyimide (PI) + FR4
Jan-03-24
Supplier From Shenzhen, China
 
ase Material

Fr4 TG140

Board Thickness

1.6 mm

Copper Thickness

1OZ

Min. Hole Size

8mil (0.2mm)

Min. Line Width/ Spacing

6mil (0.154mm)/5mil (0.125mm)

Solder mask Color

Green

Silkscreen Color

White

Surface Finishing

ENIG

Min.Quantity of Order

No MOQ

Certificate

UL, ISO 9001, ISO 14001

Difficulty

Verification Status