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High Thermal Conductivity Epoxy Adhesive

(1.0)
Supplier From China
Apr-10-23

DB118

This product is a one-component epoxy resin adhesive with high thermal conductivity, which is the best matching adhesive for thermal bonding of chips. Applicable to all kinds of electronic products, characterized by rapid thermal curing, and easy to apply. Upon cure, it has high bonding strength, good thermal conductivity, low shrinkage, low moisture absorption, good insulation performance, etc., which can reduce the working temperature of the chip, extend the life of the chip

Price and Minimum Quantity

Price: $200
MOQ: Not Specified
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2.Excellent comprehensive properties, elasticity, non-yellowing, no bleed oil
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Technical Data Table
PROPERTY STANDARD/UNITS VALUE
Before curing SI1316 SI1317
Color Visual inspection White
Viscosity 25 227;C, mPa 8226;s Paste
Density 25 227;C, g/cm3 1.65 2.25
Tack free time 25 227;C, 55%RH, min 2~5 2~5
After cured
Hardness Shore A 50 1615
Thermal conductivity W/m.K 0.82 1.50
Elongation at break % 150 100
Tensile strength MPa Y1
90 Y2
Shear strength MPa, iron/iron Y1 Y2
Dielectric strength kV/mm, 25 227;C 20 20
Loss factor 1 MHz, 25 227;C 0.09 0.09
Dielectric constant 1 MHz, 25227;C 2.9 2.9
Volume resistance (DC500V) | 8226; cm 2.01014
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