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Surface Grinding Various Wafer

Supplier From China
Oct-02-20

Application: back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, gallium arsenide, GaN wafers, silicon-based chips, etc

Grinding Machines: NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH, etc

Bonded: Vitrified bond & Resin bond

Diameter (mm): 200mm, 250mm, 280mm, 300mm, 350mm

Price and Minimum Quantity

Price: $1
MOQ: Not Specified

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Focus-6400 butyl tapes are waterproof and insulated tapes with strong adhesion
and adaptation to irregular surfaces. It exhibits excellent performance in
waterproof, sealing and anti-UV to antenna feeder and cable connection
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Main Specification
(Customized size is acceptable.)
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Main Color - Black

Technical Data
Product Series FOCUS-6400 Series
Application Communication Industry
Elongation - 400%
Heat Resistance 90, no flowing within 2h
Low Temperature Flexibility ­40, no crack on surface within 24h
Tensile Strength 175KPa
Anti UV non-hardening and no cracks within in 2000h
Corrosivity Non-corrosive to galvanizedsheet, aluminum sheet and coppersheet.

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Strong adhesion and adaptation to irregular surface.
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Workpiece Materials: grinding tungsten carbide cutting tools, ceramic, magnetic materials, silicon, glass, quartz and thermal spraying alloy, etc.
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