SECrosslink-6063 is solvent-free and fast curing at low temperature. It is used for electronic components, ceramics, glass, silicon wafers, metals and other components that need to be bonded. It is suitable for FIP process.
Brand SECrosslink Type SECrosslink-6063
Product Low temperature curing type conductive silver adhesive Curing temperature 100
Adhesive types Epoxy Application Electronics and semiconductors
Appearance Silver gray Density 4.5g/cm3
Content of effective elements 87% Volume resistivity 0.00005©cm
Curing time 0.5h Shelf life 6 months
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