Lcd Thermal Silicone Mud

SILICON WAFERS are the building blocks of modern technology, they provide the substrate onto which circuits are constructed. We offer Prime, Test, Monitor, SEMI standard, and customized silicon wafers in all diameters from 2�¢?�³ to 300mm. Our Wafers meet the SEMI standards, along with customized options.

Silicon On Insulator (SOI) Wafers: Chips fabricated on SOI wafers achieve 30% faster speeds and 80% lower power demands compared to CMOS devices. The SOI structure consists of three layers: a top active device layer for transistor fabrication, a buried oxide (BOX) insulator layer, and a bottom handle wafer layer.
Silicon Float Zone Wafers: is a crystal growth technique that produces highly pure silicon wafers with fewer impurities than traditional methods.
Silicon Thermal Oxide Wafers: Has high quality silicon thermal oxide wafers in all diameters from 2�¢?�³ to 300mm.
Silicon Nitride Wafers: Has different option of film processing for your silicon needs, including LPCVD nitride.
On Insulator (SOI): Has high quality silicon thermal oxide wafers in all diameters from 2�¢?�³ to 300mm.
Fused Silica Wafers: is the amorphous phase of quartz (SiO2).
Borofloat 33 Glass Wafers: is used in a wide range of applications like micro-optics, sensors, microlithography, semiconductor engineering, lighting, medical technology.

Thermal gel is made of silicon resin as the base material, adding thermal conductive fillers and bonding materials in a certain proportion, and processed through a special process. It has excellent high and low temperature resistance, excellent weather resistance, radiation resistance and superior dielectric properties.

Testing items Testing standard WT5921-35
Appearance Visual Blue
Oil leakage(150*48H) N/A

1 High thermal conductivity to 12W/m*K, 1~6W is most common use
2 Low thermal impedance
3 Min 0.1mm thickness
4 Extrem low hardness to 5shore C
5 Extremly low density to 1.2g/cm
6 Approved supplier of Google, Oppo, Vivo

No siloxane volatiles
High thermal performance
Exellent compressibility
Low hardness, conformable
Electrical insulation
This product is particularly suitable for silicone sensitive applications, offering low hardness, high electrical insulation and good thermally conductive.

No siloxane volatiles
High thermal performance
Exellent compressibility
Low hardness, conformable
Electrical insulation
Optical precision devices
Telecommunication
Industrial and medical electronics
Automotive ECU
This product is particularly suitable for silicone sensitive applications, offering low hardness, high electrical insulation and good thermally conductive.

Pm150 has excellent thermal conductivity and electrical insulation performance. Not only satisfy for majority
Electronic products thermal insulation requirements, but also widely used in the thermal requirements that are not too high in electronic products. With the stable heat conduction performance, and the product also has the viscosity, easy to use.
Pm150 is using soft silicone material heat-conducting, stable insulation performance, use in transmission
Interface between the electronic equipment and heat sink, which achieve heat transfer and insulation effect.
Applications:
1.Led lighting, lighting equipment
2.Household appliances lcd display
3.Between semiconductor and heat sink
4.Communication product, smart phone, tablet .
5.Desktop, notebook and other portable computer
6.Large power supply etc.
Performance and characteristics:
1.High thermal conductivity, heat transfer coefficient 1.5w/m-k
2.Stable performance, low thermal resistance, effectively improve the heat transfer speed
3.Low hardness, its viscosity high, easy to use
4.By ul and v-o certification standards
Specification:
Standard size : 200mm*400mm, 300mm*300mm, according to customer needs cutting type.
Basic thickness 0.3mm~15mm, special thickness size can be customized
Its slightly viscous, if need to strengthen the adhesive can be according to customer’s requirement
Product color is mass production color, special color can be adjusted to actual situation .

Place of Origin: Guangdong, China (Mainland)

Brand Name: laimeisi

Model Number: LMS

Type: Insulation Sheet, thermal pad

Material: silicone, thermal conductive insulation pad

Application: High Voltage, CPU GPU

Rated Voltage: 4kv

Tensile Strength: 10.4Mpa

Color: Blue

Thickness: 0.1mm-10mm

Feature: Excellent Resistance Item

name: Silicone rubber thermal conductive insulation pad

Certificate: ROHS

Hardness: 20-50 Shores

Size: Customizable

Essential details
Place of Origin: Guangdong, China
Brand Name: Cmai
Type: Insulation Sheet, Insulation Sheet
Material: Silicone, 100% silicone
Application: High Voltage
Rated Voltage: 220V
thickness: customizable
Hardness: customizable
Certificate: ROHS
Product name: thermal conductive pad
Color: customizable
Size: customizable
Sample:Avaliable
Usage: Insulation Protection
Supply Ability: 100000 Piece/Pieces per Day

LC1001 is the semi-flowing heat-resistant silicone adhesive sealant which is made of special silicone rubber material the addition of thermal powders. With excellent conductivity,V0 flame retardant grade, excellent temperature resistance, can be in the range of 60 ~ 280 Long-term use. As well as good adhesion, long term use will not fall off, will not produce Contact gap to reduce thermal conductivity, moisture-proof, anti-seismic, anti-corona, anti-leakage and aging .The properties are widely used for the adhesion and sealing of the electronic components with high thermal conductivity, which is a single part of the acetone oxime type, It can be cured silicone rubber and conforms to the requirements of ROHS REACH UL.
Typical Applications
High power LED lamps and lanterns, electrical power, microwave oven, electronic components and other industrial products of thermal conductive adhesive sealing, alternative thermal conductive silicone used in high-power electric module and radiator thermal conductivity between fixed filling adhesive, no card buckle screw, more reliable filling heat, simple process and lower cost.
Applying Process
1.Surface clean : Clean the surface of the adhesive object and remove the rust, dust and oil.
2.Sizing: Twist the cap of the hose, squeeze the gel into the clean surface, and make it natural.
3.Curing: Place the bonded or sealed parts in the air while them to solidify naturally. Curing is a process from surface to the internal, within 24 hours (at room temperature and 55% relative humidity) will cure the depth of the 2 ~ 4 mm, if the site location is deeper that completely curing time will be postpone, especially it is not easy to come into contact with air. if the temperature is low, cure time also will be postpone .Prior to further processing or wrapping the bonded parts, it is recommended that the user wait long enough to ensure that the adhesion and integrity of the adhesion are not affected.

For more , please kindly feel free to contact rita(at)szutd.com