Material: any material, including all kinds of metal, alloys, and non metal material, especially hard and brittle material such as silicon, glass, sapphire, and ceramics, as well as flexible material such as pet film, flexible pcb, all kinds of plastics.
Material thickness: 0~2mm
Min pattern size: 0.01mm(depends on thickness and shape)
Could be any shapes: circles, triangle, retangle, hexagon, polygon or any shape in cad
Tolerance: 5~20um depends on dimension
Material: any material, including all kinds of metal, alloys, and non metal material, especially hard and brittle material such as silicon, glass, sapphire, and ceramics, as well as flexible material such as PET film, flexible PCB, all kinds of plastics.
Material thickness: 0~2mm
Min pattern size: 0.01mm(depends on thickness and shape)
Could be any shapes: circles, triangle, retangle, hexagon, polygon or any shape in CAD
Tolerance: 5~20um depends on dimension
Ceramics: alumina, aluminum nitride, zirconia
Thickness: 0.1~2mm
Min feature size: 0.01mm
Could be any shapes: circles, triangle, retangle, hexagon, polygon or any shape in cad
Tolerance: 5~20um depends on dimension
Selective etching is a process that removing required layer and no hurt to any other layer, usually the removed layer should be at the top side, but in some situation, we could also remove the inside layer
We could do any pattern quickly, no mask required and chemical polluation to the product, normally the min line width and pitch could be 20~30um, in some material we could achieve less than 10um
The layer thcikness could be 10nm~10um
And we recently succeed in doulbe side etching of different patterns
Polyimide(pi) cutting and drilling
Min holes size 10um
Drilling or cutting without any thermal effect
Fast drilling process of high density micro holes
