FSM-80S fusion splicer is core-to-core alignment single fiber splicer succeeding to 60S.In addition to ruggedized concept,which 60S created,the fusion splicer 80S has a series of new features,such as Automated wind-protector and tube-heater for quicker splicing cycle as well as fewer operation steps,innovative carrying-case design for quicker preparation,powerful Li-ion battey for longer operation,high resolution bigger LCD monitor,and built-in operation manuals in various languages. Market is from backbone network installation to opto-electronics components production for quality splice.
INDIUM PHOSPHIDE (InP) WAFERS are semiconductor materials made of indium phosphide, a compound semiconductor that is widely used in high-frequency and optoelectronic applications. Due to its efficient electron mobility and direct bandgap properties, InP is favored for devices such as:
High-speed electronics
Laser diodes
Photodetectors
Telecommunications applications, including optical fiber communication
We offer the following InP Wafers:
Undoped InP Wafers: These are pure InP with no intentional doping, used in various applications where intrinsic properties are required.
N-type InP Wafers: Doped with donor impurities (such as tellurium) to increase electron concentration, useful in transistors and high-speed electronics.
P-type InP Wafers: Doped with acceptor impurities (such as zinc) to create holes in the semiconductor, used in light-emitting devices and other optoelectronics.
InP Substrates: Used as a base for growing other semiconductor materials in heterostructures for various applications.
InP Membrane Wafers: Thin layers of InP used for specific applications, including applications in flexible electronics and advanced photonic devices.
InP-based Quantum Dot Wafers: Engineered to create quantum dots that can be used in photonic and optoelectronic devices for enhanced performance.
Features:
*Digital Color display
*Simultaneous X and Y views
*9 Sec.splice time,40 Sec.tube-heat time
*Large capacity internal battery
*SYSTEM TEST ensures the best working condition
*User programmable
*Auto check fiber end face
*Auto calibrate parameters
*Store 8000 groups of splice results
*Multiple language options
Specifications:
Applicable fibers: SM,MM,DS,NZ-DS,EDF;
Cladding diameter:100 to 150um;
Coating diameter:100 to 1000um;
Fiber cleaved length:8~22mm(standard);
Splicing mode:Auto&Manual;
Average splice loss:0.02dB(SM),0.01dB(MM),0.04dB(DS),0.04dB(NZDS);
Return loss:í¦ 60dB;
Environment conditions:-25~50íµ(operation temperature),0~95% RH (humidity),0~5000m (altitude);
Storage environment:-40~80íµ(temperature),0~95%RH(humidity);
Protection sleeve length:20mm,40mm,60mm;
Tension test:2.0N (Standard);
Language: English,Chinese,Korea,Russian,Spanish etc;
Interface:RS232 interface&video output;AC adaptor:85~260V input voltage;
Power supply:Internal battery:12V voltage,10Ah, up to 200 times of continuous splices and heats;DC adaptor:12V voltage,optional multipurpose external battery;
Dimensions:160(W)í-160(H)í-180(D)mm;
Weight:4.2kg;
This handheld Gigabit Ethernet tester is used for the installation and maintenance of 10M/100M/1000M Ethernet. Its functions include network testing, data packet capture, traffic generation, cable testing and BER testing. The Ethernet tester is widely used in BER testing of layer1, layer2, layer3, and RFC-2544.
Key Features Handheld Portable Gigabit Ethernet Tester
Ergonomic design and easy to carry
Jacket cover, tie-in protection, lanyard, hands-free viewing
4.3 in LCD color touch screen, smart navigation menus
Results can be shown as texts or graphics
128 sites full line rate 10/100/1000 Mbps traffic transmission
RFC2544 automated test, fast network testing and fault location
LED indicator, LCD display
Large capacity memory for storage of settings and results
Online upgrade of firmware
Basic Functions Handheld Portable Gigabit Ethernet Tester
Full RFC2544 benchmark testing: throughput, frame loss rate, latency and back-to-back
Single and multiple site traffic generation
Compatible with VLAN tag
Connectivity testing: PING, TRACE, ARP SCAN.
Conducts termination mode test and frame length, frame type and used ratio status
Optical power test and optical module temperature, working current and voltage test
Cable VCT: capable of identifying short circuit, open circuit, cable length.
Interruption time test
Provides test tools including port positioning, packet capture, loopback.
Provides external USB drive for data exchange
Includes Test Manager Pro software for data management.
It is high cost performance:high quality but low sale price.It's available for export worldwide.
Features:
*color lcd monitor & 256 magnification
*compact & light weight
*reversible monitor with control panel on each side
*max. Wind velocity of 15m/s
*8 sec.Splice time, 40 sec.Tube-heat time
*simultaneous x and y views
*large capacity internal battery
*system test ensures the best working condition
*user programmable
*auto check fiber end face
*auto calibrate parameters
*store 8000 groups of splice results
*multiple language options
Specifications:
Applicable fibers: Sm, mm, ds, nz-ds, edf;
Cladding diameter:100 to 150um;
Coating diameter:100 to 1000um;
Fiber cleaved length:8~22mm (standard);
Splicing mode:auto & manual;
Average splice loss:0.02db(sm), 0.01db(mm), 0.04db(ds), 0.04db(nzds);
Return loss:í² 60db;
Environment conditions:-25~50íµ(operation temperature), 0~95%rh (humidity),
0~5000m (altitude);
Storage environment:-40~80íµ(temperature), 0~95úÑrh (humidity);
Protection sleeve length:20mm, 40mm, 60mm;
Tension test:2.0n (standard);
Language: english, chinese, korea, russian, spanish etc;
Interface:rs232 interface & video output;ac adaptor:85í½260v input voltage;
Power supply:internal battery:12v voltage, 10ah, up to 200 times of continuous splices and heats; dc adaptor: 12v voltageú¼optional multipurpose external battery;
Dimensions:170(w)íß140(h)íß170(d) mm;
Weight:3.3kg
