HT-65 high molecular weight polyamide resin especially designed for hot melt-adhesive use.
This resin has the characteristics of high softening point, and high molten viscosity so
that it is suitable for applications where high heat resistance, high creep strength, high adhesive
strength required and it is especially application for low pressure moulding.
Viscosity (mPas / 200C degree) - 2,000 ~ 5,000.
Please ask detailed and specific
questions about Pricing, Minimum Order Quantity, Delivery Timelines etc. Detailed Messages
result in prompt responses.
