KINGMIDE H-175SP is a high molecular weight polyamide resin especially designed for
hot melt-adhesive use. KINGMIDE H-175SP is easy to soluble in mixed organic solvent,
such as toluene and alcohol type solvent.
This resin has the characteristics of high softening point, and high molten viscosity
so that it is suitable for applications where high heat resistance and high
adhesive strength and good toughness.
Viscosity (mPa s / 232C) 3,000 ~ 6,000.
Please ask detailed and specific
questions about Pricing, Minimum Order Quantity, Delivery Timelines etc. Detailed Messages
result in prompt responses.
