1. Used with UV light exposure (with certain wave length), the adhesion is greatly reduced
(irreversible reaction), the object is then easily removed/ picked up after operation.
2. Polyolefin and Polyester films are mostly used. Good for dicing and heat resistant
purposes.
3. Used in wafer grinding,chip dicing,MLCC cutting,LED or semiconductor dicing.
4. Available with anti-static.
Please ask detailed and specific
questions about Pricing, Minimum Order Quantity, Delivery Timelines etc. Detailed Messages
result in prompt responses.
