SECrosslink-6261 high thermal conductivity, high electrical conductivity, low ion content, single component, high temperature resistance, shock resistance, used for chip bonding.
Brand SECrosslink Type SECrosslink-6261
Curing condition 200 /40 min ECA types Nano-silver
Silver content 92% Viscosity 32000CPS
Thermal conductivity 150 w/mK Shearing strength 35MPa
Silver content 91% Application Die attach
Appearance Silver gray Usage temperature -30 - 400
Please ask detailed and specific
questions about Pricing, Minimum Order Quantity, Delivery Timelines etc. Detailed Messages
result in prompt responses.
